Datasheet

...........continued
Symbol Parameter Conditions Min. Typ. Max. Unit
t
ST
ART
Startup Time – – – 120 µs
I
DDON
Current Consumption After startup time – 540 – nA
59.4.2 4/8/12 MHz RC Oscillator
The 4/8/12 MHz RC oscillator is calibrated in production. This calibration can be read through the Get CALIB bit
command (refer to the 22. Enhanced Embedded Flash Controller (EEFC)) and the frequency can be trimmed by
software through the PMC.
T
able 59-19. 4/8/12 RC Oscillator Characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
ACC
4
4 MHz Total Accuracy(2) 4 MHz output selected (see Note 1) -35 – 46 %
4 MHz output selected at 25°C (see Notes 1, 3) -1.2 – 0.8 %
ACC
8
8 MHz Total Accuracy 8 MHz output selected at 25°C (see Notes 1, 3) -1.2 – 0.8 %
ACC
12
12 MHz Total Accuracy 12 MHz output selected at 25°C (see Notes 1, 3) -1.6 – 0.8 %
Temp dependency (see Note 3) – 0.07 0.12 %/°C
t
ST
ART
Startup Time – – – 20 µs
Note:
1. Frequency range can be configured in the Supply Controller registers.
2. Not trimmed from factory.
3. After trimming at 25°C and VDDCORE = 1.2V.
59.4.3 32.768 kHz Crystal Oscillator Characteristics
Table 59-20. 32.768 kHz Crystal Oscillator Characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
1/(t
CPXIN
) XIN32 Clock Frequency (see Note) – – 32 kHz
t
CHXIN
XIN32 Clock High Half-period (see Note) 15 – – ns
t
CLXIN
XIN32 Clock Low Half-period (see Note) 15 – – ns
V
XIN_IL
V
XIN
Input Low-level Voltage (see Note) Min of V
IL
for CLOCK
pad
– Max of V
IL
for CLOCK
pad
V
V
XIN_IH
V
XIN
Input High-level Voltage (see Note) Min of V
IH
for CLOCK
pad
– Max of V
IH
for CLOCK
pad
V
Note: These characteristics apply only when the 32.768 kHz crystal oscillator is in Bypass mode.
Figure 59-9. 32.768 kHz Crystal Oscillator Schematics
XIN32
XOUT32
C
LEXT
C
LEXT
Microchip MCU
C
LEXT
= 2 × (C
CR
YSTAL
– C
PARA
– C
PCB
)
SAM E70/S70/V70/V71 Family
Electrical Characteristics for SAM E70/S70
© 2019 Microchip T
echnology Inc.
Datasheet
DS60001527D-page 1874