Datasheet

3. Ordering Information
(1)
ATSAMD 21 E 15 A - M U T
Product Family
SAMD = General Purpose Microcontroller
21 = Cortex M0 + CPU, Basic Feature Set
E = 32 Pins (35 Pins for WLCSP)
G = 48 Pins (45 Pins for WLCSP)
J = 64 Pins
No character = Tray (Default)
T = Tape and Reel
U = -40 - 85°C Matte Sn Plating
N = -40 - 105°C Matte Sn Plating
F = -40 - 125°C Matte Sn Plating
Z = -40 - 125°C Matte Sn Plating
(AEC-Q100 Qualified)
A = TQFP(4)
M = QFN(4)
U = WLCSP
(2,3)
C = UFBGA
+ DMA + USB
Product Series
Flash Memory Density
Device Variant
A = Default Variant
B = Added RWW support for 32 KB and 64 KB memory options
C = Silicon revision F for WLCSP45 package option
L = Pinout optimized for Analog and PWM
D = Silicon Revision G with RWW Support in 128KB memory options
Pin Count
Package Carrier
Package Grade
18 = 256 KB
17 = 128 KB
16 = 64 KB
15 = 32 KB
Package Type
Note:
1. Not all combinations are valid. The available ordering numbers are listed in the Configuration
Summary.
2. WLCSP package is available in -40C to 85C operating temperature range.
3. WLCSP parts are programmed with a specific SPI/I
2
C bootloader. Refer to the "Application Note
AT09002" for additional information. Contact Microchip sales office for additional information on
availability.
4. The AEC-Q100 grade 1 qualified version is only offered in the TQFP and QFN packages. The QFN
will have wettable flanks, and both packages will be assembled with gold bond wires.
SAM D21 Family
Ordering Information(1)
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 15