Datasheet

Added pinout figure for 5.4.2 WLCSP35.
9. Product Mapping
Updated Internal RWW section to start address from 0x00010000 to 0x00400000.
ADC - Analog-to-Digital Converter
References to AREFA and AREFB replaced with VREFA and VREFB respectively.
37. Electrical Characteristics
Added GPIO cluster note to '37.3 Absolute Maximum Ratings.
Added 37.16.5 I2S Timing.
Updated BOD33 characteristics.
Added characterization data for Device Variant B.
Packaging Information
Updated Θ
JC
value from 3.1 to 15.0 °C/W for 32-pin QFN package in 37.2.1 Thermal
Resistance Data.
Added package drawing for 41.1.12 35 ball WLCSP (Device Variant B).
Schematic Checklist
42.2.1 Power Supply Connections:
VDDCORE decoupling capacitor value updated from 100nF to 1μF.
References to AREFA and AREFB replaced with VREFA and VREFB respectively.
Electrical Characteristics at 125C
Added I2S Timing.
Updated BOD33 characteristics.
Added characterization data for Device Variant B.
45.15 Rev. E – 02/2015
1. Description:
CoreMark score updated from 2.14 to 2.46 CoreMark/MHz.
3. Ordering Information(1):
Added Ordering codes for Device Variant B.
Added 125°C ordering codes for QFN and TQFP package options: SAMD21E, SAM
D21E, SAM D21G, and SAM D21J, and .
Added WLCSP package option for SAM D21G .
Added UFBGA package option for SAM D21J .
5. Pinout:
SAM D21 Family
Data Sheet Revision History
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1188