Datasheet

Register HSOFC.FLENCE description updated.
USB Device Registers - Common: Bit description of CTRLB.SPDCONF[1:0] updated.
41. Packaging Information
Updated values in 37.2.1 Thermal Resistance Data.
Corrected junction temperature equations: T
C
updated to T
J
.
Updated package drawing for 41.1.12 35 ball WLCSP (Device Variant B): GPC corrected
from GJP to GJR. No other changes.
42. Schematic Checklist
Added 42.1.1 Operation in Noisy Environment.
Updated section 42.7 Programming and Debug Ports.
Updated recommended pin connection in 42.7.2 10-pin JTAGICE3 Compatible Serial
Wire Debug Interface: Pull-up resistor value on SWCLK pin changed from 10kΩ to 1kΩ.
VDDCORE decoupling capacitor value updated from 100nF to 1μF in 42.2.1 Power
Supply Connections
45.13 Rev. G – 09/2015
17. SYSCTRL – System Controller:
Updated description in 17.6.7.1.5 Drift Compensation.
37. Electrical Characteristics:
Removed note from Table 37-53 and Table 37-54.
41. Packaging Information:
Package drawing updated 41.1.8 45-ball WLCSP.
39. Electrical Characteristics at 125°C:
Removed note from:Table 39-39 and Table 39-40.
Updated power consumption units in Table 39-7.
45.14 Rev. F – 07/2015
Ordering Information
Added ATSAMD21E15B-UUT and ATSAMD21E16B-UUT ordering codes (WLCSP35
package option).
4. Block Diagram
Updated system block diagram.
5. Pinout
SAM D21 Family
Data Sheet Revision History
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1187