Datasheet

45.5 Rev. O – 12/2016
General • Introduced Device Variant C.
37. Electrical
Characteristics
• Die Revision F characterization is preliminary.
• 37.7 Power Consumption: Added Standby typical numbers for Device
Variant C / Die Revision F.
• 37.13.7 Fractional Digital Phase Locked Loop (FDPLL96M)
Characteristics: Added characterization data for Device Variant C / Die
Revision F.
39. Electrical
Characteristics at
125°C
• Die Revision F characterization is preliminary.
• 39.5 Power Consumption: Added Standby typical numbers for Device
Variant C / Die Revision F.
• 39.8.7 Fractional Digital Phase Locked Loop (FDPLL96M)
Characteristics: Added characterization data for Device Variant C / Die
Revision F.
45.6 Rev. N – 10/2016
7. I/O Multiplexing and
Considerations
• 7.1 Multiplexed Signals: Updated table note 6 with information
on PA24 and PA25.
10. Memories • 10.3.1 NVM User Row Mapping: Added BOOTPROT default
value for WLCSP.
30. TC – Timer/Counter • 30.5.3 Clocks: Corrected TC instance numbers.
• 30.6.2.4 Counter Mode: Corrected TC instance numbers.
37. Electrical Characteristics • 37.9.1 Normal I/O Pins: Added condition to Pull-up - Pull-down
resistance.
45.7 Rev. M – 09/2016
2. Configuration
Summary
• Added information on number of pins for the SAM D21G WLCSP pakcage
option. SAM D21G is offered in 48 pin packages, while the WLCSP has 45
pins.
3. Ordering
Information(1)
• Added information to the pin count explanation. For the The G letter
indicates 48 pin packages, while the WLCSP option is 45 pins.
• ATSAMD21E18A-MFUT corrected to ATSAMD21E18A-MFT.
• Device Identification:
– Removed C variants.
– Added device identification values for the devices in WLCSP
packages. These have separate device id's compared to the other
package options.
SAM D21 Family
Data Sheet Revision History
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1182