Datasheet

Table 41-39. Package Reference
JEDEC Drawing Reference N/A
JESD97 Classification e1
41.2 Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Table 41-40. Recommended Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to peak) 3°C/s max.
Preheat Temperature 175°C ±25°C 150-200°C
Time Maintained Above 217°C 60-150s
Time within 5°C of Actual Peak Temperature 30s
Peak Temperature Range 260°C
Ramp-down Rate 6°C/s max.
Time 25°C to Peak Temperature 8 minutes max.
A maximum of three reflow passes is allowed per component.
41.3 Package Markings
All devices are marked with the Atmel logo and the ordering code.
Additional marking is as follows:
Where:
• “YY”: Manufacturing year
• “WW”: Manufacturing week
• “V”: Revision
• “XXXXXXXXX”: Lot number
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1162