Datasheet

B
A
0.15
C
0.15 C
0.10 C A B
0.07 C
C
SEATING
PLANE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
0.08
C
Microchip Technology Drawing C04-6009C Sheet 1 of 2
14-Ball Wafer Level Chipscale Package (CS) - 1.57X2.36 Body [WLCSP] - PIC16LF1823
14X Øb
2X
14X
D
E
A
A2
eD
eE
A
B
C
D
E
1234
1234
A
B
C
D
E
A1
NOTE 1
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1159