Datasheet

Microchip Technology Drawing C04-21245 Rev A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
35-Ball Wafer Level Chip Scale Package (FQB) - 2.821x2.529 mm Body [WLCSP]
A1
A2
(A3)
0.075 C
35X
0.10 C
DETAIL A
Number of Terminals
Overall Height
Terminal Width
Overall Width
Pitch
Bump Height
Units
Dimension Limits
A1
A
b
e
E
N
0.40 BSC
0.23
-
0.17
0.26
-
0.20
2.821 BSC
MILLIMETERS
MIN
NOM
35
0.29
0.483
0.23
MAX
Overall Length D 2.529 BSC
A3
A2
Backside Coating
Die Thickness 0.178 0.203 0.228
0.04 REF
Overall Bump Pitch E1
Overall Bump Pitch D1
2.00 BSC
2.00 BSC
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1158