Datasheet

41.1.12 35 ball WLCSP (Device Variant B)
(DATUM B)
(DATUM A)
SIDE VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-21245 Rev A Sheet 1 of 2
e
2
D1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
35-Ball Wafer Level Chip Scale Package (FQB) - 2.821x2.529 mm Body [WLCSP]
© 2017 Microchip Technology Inc.
B
A
0.03
C
0.03
C
C
SEATING
PLANE
2X
TOP VIEW
NOTE 1
2X
D
E
A
SEE DETAIL A
E1
0.15 C A B
0.05 C
35X Øb
e
NOTE 1
1
2345 6
123456
F
E
D
C
B
A
F
E
D
C
B
A
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1157