Datasheet

41.1.10 32 pin QFN
Note: The exposed die attach pad is connected inside the device to GND and GNDANA.
Table 41-28. Device and Package Maximum Weight
90 mg
Table 41-29. Package Characteristics
Moisture Sensitivity Level MSL3
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1154