Datasheet

41.1.6 48 pin QFN
Note: The exposed die attach pad is not connected electrically inside the device.
Table 41-16. Device and Package Maximum Weight
140 mg
Table 41-17. Package Characteristics
Moisture Sensitivity Level MSL3
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1146