Datasheet

Table 41-8. Package Characteristics
Moisture Sensitivity Level MSL3
Table 41-9. Package Reference
JEDEC Drawing Reference MO-220
JESD97 Classification E3
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
41.1.4 64-ball UFBGA
Table 41-10. Device and Package Maximum Weight
27.4 mg
SAM D21 Family
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001882D-page 1143