Datasheet

1449
SAM3X / SAM3A [DATASHEET]
Atmel-11057C-ATARM-SAM3X-SAM3A-Datasheet_23-Mar-15
23-Mar-15
Section 45. “Electrical Characteristics” (cont’d)
Section 45.10.7 “USART in SPI Mode Timings”: updated conditions
Figure 45-39 “EMAC RMII Timings”: inserted RMII-specific diagram (was previously extract of “EMAC MII Mode”
diagram)
Table 45-61 ”Two-wire Serial Bus Requirements”: in bottom row, replaced duplicated parameter “Hold Time (repeated)
START Condition” with new parameter ““Bus free time between a STOP and START condition”
Section 45.10.10 “Embedded Flash Characteristics”: corrected “field FWS of the MC_FMR register” to “field FWS in the
EEFC_FMR”; updated text and replaced two wait state tables with single Table 45-62 ”Embedded Flash Wait State -
VDDCORE 1.62V/1.80V”
Section 46. “Mechanical Characteristics”
Figure 46-2 “100-ball TFBGA Package Drawing”: corrected ‘A’ maximum dimension in inches from 0.0575 to 0.0433
Updated Table 46-4 ”100-ball TFBGA Package Reference - Soldering Information (Substrate Level)”
Updated Table 46-5 ”100-ball TFBGA Device and Package Maximum Weight”
Updated Table 46-6 ”100-ball TFBGA Package Characteristics”
Updated Table 46-7 ”100-ball TFBGA Package Reference”
Updated Table 46-8 ”144-lead LQFP Device and Package Maximum Weight”
Added Section 46.1 “Soldering Profile”
Added Section 46.2 “Packaging Resources”
Inserted Section 47. “Marking” (was previously subsection of Section 49. “SAM3X/A Series Errata”)
Section 48. “Ordering Information”
Section 48-1 “SAM3X/A Ordering Information”: removed “Package Type” column (this information is provided on the
Atmel website); renamed “LFBGA100” to “TFBGA100”
Section 49. “SAM3X/A Series Errata”
Added Section 49.1.2.3 “Backup Mode Power-Up Sequence”
Table 50-1. SAM3X/SAM3A Datasheet Rev. 11057C Revision History (Continued)
Issue Date Comments