Datasheet

DRAFT
SAM3X / SAM3A [DATASHEET]
Atmel-11057C-ATARM-SAM3X-SAM3A-Datasheet_23-Mar-15
1438
Figure 46-4. 144-ball LFBGA Package Drawing
Table 46-11. Soldering Information (Substrate Level)
Ball Land 0.380 mm
Soldering Mask Opening 0.280 mm
Table 46-12. 144-ball BGA Device and Package Maximum Weight
300 mg
Table 46-13. 144-ball BGA Package Characteristics
Moisture Sensitivity Level 3
Table 46-14. Package Reference
JEDEC Drawing Reference none
JESD97 Classification e1
All dimensions are in mm