Datasheet

DRAFT
SAM3X / SAM3A [DATASHEET]
Atmel-11057C-ATARM-SAM3X-SAM3A-Datasheet_23-Mar-15
1436
Figure 46-2. 100-ball TFBGA Package Drawing
Table 46-4. 100-ball TFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land Diameter 0.45 mm
Soldering Mask Opening 0.35 mm
Table 46-5. 100-ball TFBGA Device and Package Maximum Weight
141 mg
Table 46-6. 100-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 46-7. 100-ball TFBGA Package Reference
JEDEC Drawing Reference MO-275-DDAC-1
JESD97 Classification e8