Datasheet

1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for

detailed ordering information and minimum quantities.

2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances

(RoHS directive). Also Halide free and fully Green.

3. Please refer to Speed Grades for Speed vs. V

4. Tape & Reel.

5. NiPdAu Lead Finish.

Package Type

28M1 28-pad, 4 x 4 x 1.0 body, Lead Pitch 0.45mm Quad Flat No-Lead/Micro Lead Frame Package (QFN/

MLF)

28P3 28-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP)

32M1-A 32-pad, 5 x 5 x 1.0 body, Lead Pitch 0.50mm Quad Flat No-Lead/Micro Lead Frame Package (QFN/

MLF)

32A 32-lead, Thin (1.0mm) Plastic Quad Flat Package (TQFP)

32CC1 32-ball, 4 x 4 x 0.6mm package, ball pitch 0.5mm, Ultra Thin, Fine-Pitch Ball Grill Array (UFBGA)

ATmega48A/88A/168A

Ordering Information

Datasheet Complete

DS40002007A-page 14