Datasheet
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Description
- 2. Configuration Summary
- 3. Ordering Information
- 4. Block Diagram
- 5. Pin Configurations
- 6. Resources
- 7. Data Retention
- 8. About Code Examples
- 9. Capacitive Touch Sensing
- 10. AVR CPU Core
- 11. AVR Memories
- 12. System Clock and Clock Options
- 13. Power Management and Sleep Modes
- 14. System Control and Reset
- 15. Interrupts
- 16. External Interrupts
- 17. I/O Ports
- 17.1. Overview
- 17.2. Ports as General Digital I/O
- 17.3. Alternate Port Functions
- 17.4. Register Description
- 17.4.1. SFIOR – Special Function IO Register
- 17.4.2. PORTA – Port A Data Register
- 17.4.3. DDRA – Port A Data Direction Register
- 17.4.4. PINA – Port A Input Pins Address
- 17.4.5. PORTB – The Port B Data Register
- 17.4.6. DDRB – The Port B Data Direction Register
- 17.4.7. PINB – The Port B Input Pins Address
- 17.4.8. PORTC – The Port C Data Register
- 17.4.9. DDRC – The Port C Data Direction Register
- 17.4.10. PINC – The Port C Input Pins Address
- 17.4.11. PORTD – The Port D Data Register
- 17.4.12. DDRD – The Port D Data Direction Register
- 17.4.13. PIND – The Port D Input Pins Address
- 18. Timer/Counter0 and Timer/Counter1 Prescalers
- 19. 16-bit Timer/Counter1
- 19.1. Features
- 19.2. Overview
- 19.3. Accessing 16-bit Registers
- 19.4. Timer/Counter Clock Sources
- 19.5. Counter Unit
- 19.6. Input Capture Unit
- 19.7. Output Compare Units
- 19.8. Compare Match Output Unit
- 19.9. Modes of Operation
- 19.10. Timer/Counter Timing Diagrams
- 19.11. Register Description
- 19.11.1. TCCR1A – Timer/Counter1 Control Register A
- 19.11.2. TCCR1B – Timer/Counter1 Control Register B
- 19.11.3. TCNT1L – Timer/Counter1 Low byte
- 19.11.4. TCNT1H – Timer/Counter1 High byte
- 19.11.5. OCR1AL – Output Compare Register 1 A Low byte
- 19.11.6. OCR1AH – Output Compare Register 1 A High byte
- 19.11.7. OCR1BL – Output Compare Register 1 B Low byte
- 19.11.8. OCR1BH – Output Compare Register 1 B High byte
- 19.11.9. ICR1L – Input Capture Register 1 Low byte
- 19.11.10. ICR1H – Input Capture Register 1 High byte
- 19.11.11. TIMSK – Timer/Counter Interrupt Mask Register
- 19.11.12. TIFR – Timer/Counter Interrupt Flag Register
- 20. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 20.1. Features
- 20.2. Overview
- 20.3. Timer/Counter Clock Sources
- 20.4. Counter Unit
- 20.5. Output Compare Unit
- 20.6. Compare Match Output Unit
- 20.7. Modes of Operation
- 20.8. Timer/Counter Timing Diagrams
- 20.9. Asynchronous Operation of the Timer/Counter
- 20.10. Timer/Counter Prescaler
- 20.11. Register Description
- 20.11.1. TCCR2 – Timer/Counter Control Register
- 20.11.2. TCNT0 – Timer/Counter Register
- 20.11.3. OCR0 – Output Compare Register
- 20.11.4. ASSR – Asynchronous Status Register
- 20.11.5. TIMSK – Timer/Counter Interrupt Mask Register
- 20.11.6. TIFR – Timer/Counter Interrupt Flag Register
- 20.11.7. SFIOR – Special Function IO Register
- 21. 8-bit Timer/Counter0 with PWM
- 22. SPI – Serial Peripheral Interface
- 23. USART - Universal Synchronous and Asynchronous serial Receiver and Transmitter
- 23.1. Features
- 23.2. Overview
- 23.3. Clock Generation
- 23.4. Frame Formats
- 23.5. USART Initialization
- 23.6. Data Transmission – The USART Transmitter
- 23.7. Data Reception – The USART Receiver
- 23.8. Asynchronous Data Reception
- 23.9. Multi-Processor Communication Mode
- 23.10. Accessing UBRRH/UCSRC Registers
- 23.11. Register Description
- 23.12. Examples of Baud Rate Setting
- 24. TWI - Two-wire Serial Interface
- 25. AC - Analog Comparator
- 26. ADC - Analog to Digital Converter
- 26.1. Features
- 26.2. Overview
- 26.3. Starting a Conversion
- 26.4. Prescaling and Conversion Timing
- 26.5. Changing Channel or Reference Selection
- 26.6. ADC Noise Canceler
- 26.7. ADC Conversion Result
- 26.8. Register Description
- 26.8.1. ADMUX – ADC Multiplexer Selection Register
- 26.8.2. ADCSRA – ADC Control and Status Register A
- 26.8.3. ADCL – ADC Data Register Low (ADLAR=0)
- 26.8.4. ADCH – ADC Data Register High (ADLAR=0)
- 26.8.5. ADCL – ADC Data Register Low (ADLAR=1)
- 26.8.6. ADCH – ADC Data Register High (ADLAR=1)
- 26.8.7. SFIOR – Special Function IO Register
- 27. JTAG Interface and On-chip Debug System
- 27.1. Features
- 27.2. Overview
- 27.3. TAP – Test Access Port
- 27.4. TAP Controller
- 27.5. Using the Boundary-scan Chain
- 27.6. Using the On-chip Debug System
- 27.7. On-chip Debug Specific JTAG Instructions
- 27.8. Using the JTAG Programming Capabilities
- 27.9. Bibliography
- 27.10. IEEE 1149.1 (JTAG) Boundary-scan
- 27.11. Data Registers
- 27.12. Boundry-scan Specific JTAG Instructions
- 27.13. Boundary-scan Chain
- 27.14. ATmega32A Boundary-scan Order
- 27.15. Boundary-scan Description Language Files
- 27.16. Register Description
- 28. BTLDR - Boot Loader Support – Read-While-Write Self-Programming
- 28.1. Features
- 28.2. Overview
- 28.3. Application and Boot Loader Flash Sections
- 28.4. Read-While-Write and No Read-While-Write Flash Sections
- 28.5. Boot Loader Lock Bits
- 28.6. Entering the Boot Loader Program
- 28.7. Addressing the Flash During Self-Programming
- 28.8. Self-Programming the Flash
- 28.8.1. Performing Page Erase by SPM
- 28.8.2. Filling the Temporary Buffer (Page Loading)
- 28.8.3. Performing a Page Write
- 28.8.4. Using the SPM Interrupt
- 28.8.5. Consideration While Updating Boot Loader Section (BLS)
- 28.8.6. Prevent Reading the RWW Section During Self-Programming
- 28.8.7. Setting the Boot Loader Lock Bits by SPM
- 28.8.8. EEPROM Write Prevents Writing to SPMCR
- 28.8.9. Reading the Fuse and Lock Bits from Software
- 28.8.10. Preventing Flash Corruption
- 28.8.11. Programming Time for Flash when Using SPM
- 28.8.12. Simple Assembly Code Example for a Boot Loader
- 28.8.13. ATmega32A Boot Loader Parameters
- 28.9. Register Description
- 29. Memory Programming
- 29.1. Program and Data Memory Lock Bits
- 29.2. Fuse Bits
- 29.3. Signature Bytes
- 29.4. Signature Bytes
- 29.5. Calibration Byte
- 29.6. Parallel Programming Parameters, Pin Mapping, and Commands
- 29.7. Parallel Programming
- 29.7.1. Enter Programming Mode
- 29.7.2. Considerations for Efficient Programming
- 29.7.3. Chip Erase
- 29.7.4. Programming the Flash
- 29.7.5. Programming the EEPROM
- 29.7.6. Reading the Flash
- 29.7.7. Reading the EEPROM
- 29.7.8. Programming the Fuse Low Bits
- 29.7.9. Programming the Fuse High Bits
- 29.7.10. Programming the Lock Bits
- 29.7.11. Reading the Fuse and Lock Bits
- 29.7.12. Reading the Signature Bytes
- 29.7.13. Reading the Calibration Byte
- 29.7.14. Parallel Programming Characteristics
- 29.8. Serial Downloading
- 29.9. Serial Programming Pin Mapping
- 29.10. Programming Via the JTAG Interface
- 29.10.1. Programming Specific JTAG Instructions
- 29.10.2. AVR_RESET (0xC)
- 29.10.3. PROG_ENABLE (0x4)
- 29.10.4. PROG_COMMANDS (0x5)
- 29.10.5. PROG_PAGELOAD (0x6)
- 29.10.6. PROG_PAGEREAD (0x7)
- 29.10.7. Data Registers
- 29.10.8. Reset Register
- 29.10.9. Programming Enable Register
- 29.10.10. Programming Command Register
- 29.10.11. Virtual Flash Page Load Register
- 29.10.12. Virtual Flash Page Read Register
- 29.10.13. Programming Algorithm
- 29.10.14. Entering Programming Mode
- 29.10.15. Leaving Programming Mode
- 29.10.16. Performing Chip Erase
- 29.10.17. Programming the Flash
- 29.10.18. Reading the Flash
- 29.10.19. Programming the EEPROM
- 29.10.20. Reading the EEPROM
- 29.10.21. Programming the Fuses
- 29.10.22. Programming the Lock Bits
- 29.10.23. Reading the Fuses and Lock Bits
- 29.10.24. Reading the Signature Bytes
- 29.10.25. Reading the Calibration Byte
- 30. Electrical Characteristics
- 31. Typical Characteristics
- 31.1. Active Supply Current
- 31.2. Idle Supply Current
- 31.3. Power-down Supply Current
- 31.4. Power-save Supply current
- 31.5. Standby Supply Current
- 31.6. Pin Pull-up
- 31.7. Pin Driver Strength
- 31.8. Pin Thresholds and Hysteresis
- 31.9. BOD Thresholds and Analog Comparator Offset
- 31.10. Internal Oscillator Speed
- 31.11. Current Consumption of Peripheral Units
- 31.12. Current Consumption in Reset and Reset Pulsewidth
- 32. Register Summary
- 33. Instruction Set Summary
- 34. Packaging Information
- 35. Errata
- 36. Datasheet Revision History

13.8.3. Brown-out Detector
If the Brown-out Detector is not needed in the application, this module should be turned off. If the Brown-
out Detector is enabled by the BODEN Fuse, it will be enabled in all sleep modes, and hence, always
consume power. In the deeper sleep modes, this will contribute significantly to the total current
consumption. Refer to Brown-out Detection for details on how to configure the Brown-out Detector.
Related Links
Brown-out Detection on page 56
13.8.4. Internal Voltage Reference
The Internal Voltage Reference will be enabled when needed by the Brown-out Detector, the Analog
Comparator or the ADC. If these modules are disabled as described in the sections above, the internal
voltage reference will be disabled and it will not be consuming power. When turned on again, the user
must allow the reference to start up before the output is used. If the reference is kept on in sleep mode,
the output can be used immediately. Refer to Internal Voltage Reference for details on the start-up time.
Related Links
Internal Voltage Reference on page 57
13.8.5. Watchdog Timer
If the Watchdog Timer is not needed in the application, this module should be turned off. If the Watchdog
Timer is enabled, it will be enabled in all sleep modes, and hence, always consume power. In the deeper
sleep modes, this will contribute significantly to the total current consumption. Refer to Watchdog Timer
for details on how to configure the Watchdog Timer.
Related Links
Watchdog Timer on page 57
13.8.6. Port Pins
When entering a sleep mode, all port pins should be configured to use minimum power. The most
important thing is then to ensure that no pins drive resistive loads. In sleep modes where the both the I/O
clock (clk
I/O
) and the ADC clock (clk
ADC
) are stopped, the input buffers of the device will be disabled. This
ensures that no power is consumed by the input logic when not needed. In some cases, the input logic is
needed for detecting wake-up conditions, and it will then be enabled. Refer to the section Digital Input
Enable and Sleep Modes for details on which pins are enabled. If the input buffer is enabled and the input
signal is left floating or have an analog signal level close to V
CC
/2, the input buffer will use excessive
power.
Related Links
Digital Input Enable and Sleep Modes on page 78
13.8.7. JTAG Interface and On-chip Debug System
If the On-chip debug system is enabled by the OCDEN Fuse and the chip enter Power down or Power
save sleep mode, the main clock source remains enabled. In these sleep modes, this will contribute
significantly to the total current consumption. There are three alternative ways to avoid this:
• Disable OCDEN Fuse.
• Disable JTAGEN Fuse.
• Write one to the JTD bit in MCUCSR.
The TDO pin is left floating when the JTAG interface is enabled while the JTAG TAP controller is not
shifting data. If the hardware connected to the TDO pin does not pull up the logic level, power
consumption will increase. Note that the TDI pin for the next device in the scan chain contains a pull-up
Atmel ATmega32A [DATASHEET]
Atmel-8155I-ATmega32A_Datasheet_Complete-08/2016
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