Datasheet
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Description
- 2. Configuration Summary
- 3. Ordering Information
- 4. Block Diagram
- 5. Pin Configurations
- 6. Resources
- 7. Data Retention
- 8. About Code Examples
- 9. Capacitive Touch Sensing
- 10. AVR CPU Core
- 11. AVR Memories
- 12. System Clock and Clock Options
- 13. Power Management and Sleep Modes
- 14. System Control and Reset
- 15. Interrupts
- 16. External Interrupts
- 17. I/O Ports
- 17.1. Overview
- 17.2. Ports as General Digital I/O
- 17.3. Alternate Port Functions
- 17.4. Register Description
- 17.4.1. SFIOR – Special Function IO Register
- 17.4.2. PORTA – Port A Data Register
- 17.4.3. DDRA – Port A Data Direction Register
- 17.4.4. PINA – Port A Input Pins Address
- 17.4.5. PORTB – The Port B Data Register
- 17.4.6. DDRB – The Port B Data Direction Register
- 17.4.7. PINB – The Port B Input Pins Address
- 17.4.8. PORTC – The Port C Data Register
- 17.4.9. DDRC – The Port C Data Direction Register
- 17.4.10. PINC – The Port C Input Pins Address
- 17.4.11. PORTD – The Port D Data Register
- 17.4.12. DDRD – The Port D Data Direction Register
- 17.4.13. PIND – The Port D Input Pins Address
- 18. Timer/Counter0 and Timer/Counter1 Prescalers
- 19. 16-bit Timer/Counter1
- 19.1. Features
- 19.2. Overview
- 19.3. Accessing 16-bit Registers
- 19.4. Timer/Counter Clock Sources
- 19.5. Counter Unit
- 19.6. Input Capture Unit
- 19.7. Output Compare Units
- 19.8. Compare Match Output Unit
- 19.9. Modes of Operation
- 19.10. Timer/Counter Timing Diagrams
- 19.11. Register Description
- 19.11.1. TCCR1A – Timer/Counter1 Control Register A
- 19.11.2. TCCR1B – Timer/Counter1 Control Register B
- 19.11.3. TCNT1L – Timer/Counter1 Low byte
- 19.11.4. TCNT1H – Timer/Counter1 High byte
- 19.11.5. OCR1AL – Output Compare Register 1 A Low byte
- 19.11.6. OCR1AH – Output Compare Register 1 A High byte
- 19.11.7. OCR1BL – Output Compare Register 1 B Low byte
- 19.11.8. OCR1BH – Output Compare Register 1 B High byte
- 19.11.9. ICR1L – Input Capture Register 1 Low byte
- 19.11.10. ICR1H – Input Capture Register 1 High byte
- 19.11.11. TIMSK – Timer/Counter Interrupt Mask Register
- 19.11.12. TIFR – Timer/Counter Interrupt Flag Register
- 20. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 20.1. Features
- 20.2. Overview
- 20.3. Timer/Counter Clock Sources
- 20.4. Counter Unit
- 20.5. Output Compare Unit
- 20.6. Compare Match Output Unit
- 20.7. Modes of Operation
- 20.8. Timer/Counter Timing Diagrams
- 20.9. Asynchronous Operation of the Timer/Counter
- 20.10. Timer/Counter Prescaler
- 20.11. Register Description
- 20.11.1. TCCR2 – Timer/Counter Control Register
- 20.11.2. TCNT0 – Timer/Counter Register
- 20.11.3. OCR0 – Output Compare Register
- 20.11.4. ASSR – Asynchronous Status Register
- 20.11.5. TIMSK – Timer/Counter Interrupt Mask Register
- 20.11.6. TIFR – Timer/Counter Interrupt Flag Register
- 20.11.7. SFIOR – Special Function IO Register
- 21. 8-bit Timer/Counter0 with PWM
- 22. SPI – Serial Peripheral Interface
- 23. USART - Universal Synchronous and Asynchronous serial Receiver and Transmitter
- 23.1. Features
- 23.2. Overview
- 23.3. Clock Generation
- 23.4. Frame Formats
- 23.5. USART Initialization
- 23.6. Data Transmission – The USART Transmitter
- 23.7. Data Reception – The USART Receiver
- 23.8. Asynchronous Data Reception
- 23.9. Multi-Processor Communication Mode
- 23.10. Accessing UBRRH/UCSRC Registers
- 23.11. Register Description
- 23.12. Examples of Baud Rate Setting
- 24. TWI - Two-wire Serial Interface
- 25. AC - Analog Comparator
- 26. ADC - Analog to Digital Converter
- 26.1. Features
- 26.2. Overview
- 26.3. Starting a Conversion
- 26.4. Prescaling and Conversion Timing
- 26.5. Changing Channel or Reference Selection
- 26.6. ADC Noise Canceler
- 26.7. ADC Conversion Result
- 26.8. Register Description
- 26.8.1. ADMUX – ADC Multiplexer Selection Register
- 26.8.2. ADCSRA – ADC Control and Status Register A
- 26.8.3. ADCL – ADC Data Register Low (ADLAR=0)
- 26.8.4. ADCH – ADC Data Register High (ADLAR=0)
- 26.8.5. ADCL – ADC Data Register Low (ADLAR=1)
- 26.8.6. ADCH – ADC Data Register High (ADLAR=1)
- 26.8.7. SFIOR – Special Function IO Register
- 27. JTAG Interface and On-chip Debug System
- 27.1. Features
- 27.2. Overview
- 27.3. TAP – Test Access Port
- 27.4. TAP Controller
- 27.5. Using the Boundary-scan Chain
- 27.6. Using the On-chip Debug System
- 27.7. On-chip Debug Specific JTAG Instructions
- 27.8. Using the JTAG Programming Capabilities
- 27.9. Bibliography
- 27.10. IEEE 1149.1 (JTAG) Boundary-scan
- 27.11. Data Registers
- 27.12. Boundry-scan Specific JTAG Instructions
- 27.13. Boundary-scan Chain
- 27.14. ATmega32A Boundary-scan Order
- 27.15. Boundary-scan Description Language Files
- 27.16. Register Description
- 28. BTLDR - Boot Loader Support – Read-While-Write Self-Programming
- 28.1. Features
- 28.2. Overview
- 28.3. Application and Boot Loader Flash Sections
- 28.4. Read-While-Write and No Read-While-Write Flash Sections
- 28.5. Boot Loader Lock Bits
- 28.6. Entering the Boot Loader Program
- 28.7. Addressing the Flash During Self-Programming
- 28.8. Self-Programming the Flash
- 28.8.1. Performing Page Erase by SPM
- 28.8.2. Filling the Temporary Buffer (Page Loading)
- 28.8.3. Performing a Page Write
- 28.8.4. Using the SPM Interrupt
- 28.8.5. Consideration While Updating Boot Loader Section (BLS)
- 28.8.6. Prevent Reading the RWW Section During Self-Programming
- 28.8.7. Setting the Boot Loader Lock Bits by SPM
- 28.8.8. EEPROM Write Prevents Writing to SPMCR
- 28.8.9. Reading the Fuse and Lock Bits from Software
- 28.8.10. Preventing Flash Corruption
- 28.8.11. Programming Time for Flash when Using SPM
- 28.8.12. Simple Assembly Code Example for a Boot Loader
- 28.8.13. ATmega32A Boot Loader Parameters
- 28.9. Register Description
- 29. Memory Programming
- 29.1. Program and Data Memory Lock Bits
- 29.2. Fuse Bits
- 29.3. Signature Bytes
- 29.4. Signature Bytes
- 29.5. Calibration Byte
- 29.6. Parallel Programming Parameters, Pin Mapping, and Commands
- 29.7. Parallel Programming
- 29.7.1. Enter Programming Mode
- 29.7.2. Considerations for Efficient Programming
- 29.7.3. Chip Erase
- 29.7.4. Programming the Flash
- 29.7.5. Programming the EEPROM
- 29.7.6. Reading the Flash
- 29.7.7. Reading the EEPROM
- 29.7.8. Programming the Fuse Low Bits
- 29.7.9. Programming the Fuse High Bits
- 29.7.10. Programming the Lock Bits
- 29.7.11. Reading the Fuse and Lock Bits
- 29.7.12. Reading the Signature Bytes
- 29.7.13. Reading the Calibration Byte
- 29.7.14. Parallel Programming Characteristics
- 29.8. Serial Downloading
- 29.9. Serial Programming Pin Mapping
- 29.10. Programming Via the JTAG Interface
- 29.10.1. Programming Specific JTAG Instructions
- 29.10.2. AVR_RESET (0xC)
- 29.10.3. PROG_ENABLE (0x4)
- 29.10.4. PROG_COMMANDS (0x5)
- 29.10.5. PROG_PAGELOAD (0x6)
- 29.10.6. PROG_PAGEREAD (0x7)
- 29.10.7. Data Registers
- 29.10.8. Reset Register
- 29.10.9. Programming Enable Register
- 29.10.10. Programming Command Register
- 29.10.11. Virtual Flash Page Load Register
- 29.10.12. Virtual Flash Page Read Register
- 29.10.13. Programming Algorithm
- 29.10.14. Entering Programming Mode
- 29.10.15. Leaving Programming Mode
- 29.10.16. Performing Chip Erase
- 29.10.17. Programming the Flash
- 29.10.18. Reading the Flash
- 29.10.19. Programming the EEPROM
- 29.10.20. Reading the EEPROM
- 29.10.21. Programming the Fuses
- 29.10.22. Programming the Lock Bits
- 29.10.23. Reading the Fuses and Lock Bits
- 29.10.24. Reading the Signature Bytes
- 29.10.25. Reading the Calibration Byte
- 30. Electrical Characteristics
- 31. Typical Characteristics
- 31.1. Active Supply Current
- 31.2. Idle Supply Current
- 31.3. Power-down Supply Current
- 31.4. Power-save Supply current
- 31.5. Standby Supply Current
- 31.6. Pin Pull-up
- 31.7. Pin Driver Strength
- 31.8. Pin Thresholds and Hysteresis
- 31.9. BOD Thresholds and Analog Comparator Offset
- 31.10. Internal Oscillator Speed
- 31.11. Current Consumption of Peripheral Units
- 31.12. Current Consumption in Reset and Reset Pulsewidth
- 32. Register Summary
- 33. Instruction Set Summary
- 34. Packaging Information
- 35. Errata
- 36. Datasheet Revision History

Bit 7 6 5 4 3 2 1 0
Rd – – – – – – LB2 LB1
BLB01
BLB02
BLB11
BLB12
–
– LB2
LB1
The algorithm for reading the Fuse Low bits is similar to the one described above for reading the Lock
Bits. To read the Fuse Low bits, load the Z-pointer with 0x0000 and set the BLBSET and SPMEN bits in
SPMCR. When an LPM instruction is executed within three cycles after the BLBSET and SPMEN bits are
set in the SPMCR, the value of the Fuse Low bits (FLB) will be loaded in the destination register as
shown below. Refer to table Fuse Low Byte in section Fuse Bits for a detailed description and mapping of
the fuse low bits.
Bit 7 6 5 4 3 2 1 0
Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0
Similarly, when reading the Fuse High bits, load 0x0003 in the Z-pointer. When an LPM instruction is
executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCR, the value of the
Fuse High bits (FHB) will be loaded in the destination register as shown below. Refer to table Fuse High
Byte in section Fuse Bits for detailed description and mapping of the fuse high bits.
Bit 7 6 5 4 3 2 1 0
Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0
Fuse and Lock bits that are programmed read as '0'. Fuse and Lock bits that are unprogrammed, will read
as '1'.
28.8.10. Preventing Flash Corruption
During periods of low V
CC
, the Flash program can be corrupted because the supply voltage is too low for
the CPU and the Flash to operate properly. These issues are the same as for board level systems using
the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a regular
write sequence to the Flash requires a minimum voltage to operate correctly. Secondly, the CPU itself can
execute instructions incorrectly, if the supply voltage for executing instructions is too low.
Flash corruption can easily be avoided by following these design recommendations (one is sufficient):
1. If there is no need for a Boot Loader update in the system, program the Boot Loader Lock bits to
prevent any Boot Loader software updates.
2. Keep the AVR RESET active (low) during periods of insufficient power supply voltage. This can be
done by enabling the internal Brown-out Detector (BOD) if the operating voltage matches the
detection level. If not, an external low V
CC
reset protection circuit can be used. If a reset occurs
while a write operation is in progress, the write operation will be completed provided that the power
supply voltage is sufficient.
3. Keep the AVR core in Power-down sleep mode during periods of low V
CC
. This will prevent the
CPU from attempting to decode and execute instructions, effectively protecting the SPMCR
Register and thus the Flash from unintentional writes.
28.8.11. Programming Time for Flash when Using SPM
The calibrated RC Oscillator is used to time Flash accesses. The following table shows the typical
programming time for Flash accesses from the CPU.
Table 28-5. SPM Programming Time
(1)
Symbol Min. Programming Time Max. Programming Time
Flash write (Page Erase, Page Write, and write Lock bits
by SPM)
3.7ms 4.5ms
Note: 1. Minimum and maximum programming time is per individual operation.
Atmel ATmega32A [DATASHEET]
Atmel-8155I-ATmega32A_Datasheet_Complete-08/2016
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