Datasheet
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Description
- 2. Configuration Summary
- 3. Ordering Information
- 4. Block Diagram
- 5. Pin Configurations
- 6. Resources
- 7. Data Retention
- 8. About Code Examples
- 9. Capacitive Touch Sensing
- 10. AVR CPU Core
- 11. AVR Memories
- 12. System Clock and Clock Options
- 13. Power Management and Sleep Modes
- 14. System Control and Reset
- 15. Interrupts
- 16. External Interrupts
- 17. I/O Ports
- 17.1. Overview
- 17.2. Ports as General Digital I/O
- 17.3. Alternate Port Functions
- 17.4. Register Description
- 17.4.1. SFIOR – Special Function IO Register
- 17.4.2. PORTA – Port A Data Register
- 17.4.3. DDRA – Port A Data Direction Register
- 17.4.4. PINA – Port A Input Pins Address
- 17.4.5. PORTB – The Port B Data Register
- 17.4.6. DDRB – The Port B Data Direction Register
- 17.4.7. PINB – The Port B Input Pins Address
- 17.4.8. PORTC – The Port C Data Register
- 17.4.9. DDRC – The Port C Data Direction Register
- 17.4.10. PINC – The Port C Input Pins Address
- 17.4.11. PORTD – The Port D Data Register
- 17.4.12. DDRD – The Port D Data Direction Register
- 17.4.13. PIND – The Port D Input Pins Address
- 18. Timer/Counter0 and Timer/Counter1 Prescalers
- 19. 16-bit Timer/Counter1
- 19.1. Features
- 19.2. Overview
- 19.3. Accessing 16-bit Registers
- 19.4. Timer/Counter Clock Sources
- 19.5. Counter Unit
- 19.6. Input Capture Unit
- 19.7. Output Compare Units
- 19.8. Compare Match Output Unit
- 19.9. Modes of Operation
- 19.10. Timer/Counter Timing Diagrams
- 19.11. Register Description
- 19.11.1. TCCR1A – Timer/Counter1 Control Register A
- 19.11.2. TCCR1B – Timer/Counter1 Control Register B
- 19.11.3. TCNT1L – Timer/Counter1 Low byte
- 19.11.4. TCNT1H – Timer/Counter1 High byte
- 19.11.5. OCR1AL – Output Compare Register 1 A Low byte
- 19.11.6. OCR1AH – Output Compare Register 1 A High byte
- 19.11.7. OCR1BL – Output Compare Register 1 B Low byte
- 19.11.8. OCR1BH – Output Compare Register 1 B High byte
- 19.11.9. ICR1L – Input Capture Register 1 Low byte
- 19.11.10. ICR1H – Input Capture Register 1 High byte
- 19.11.11. TIMSK – Timer/Counter Interrupt Mask Register
- 19.11.12. TIFR – Timer/Counter Interrupt Flag Register
- 20. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 20.1. Features
- 20.2. Overview
- 20.3. Timer/Counter Clock Sources
- 20.4. Counter Unit
- 20.5. Output Compare Unit
- 20.6. Compare Match Output Unit
- 20.7. Modes of Operation
- 20.8. Timer/Counter Timing Diagrams
- 20.9. Asynchronous Operation of the Timer/Counter
- 20.10. Timer/Counter Prescaler
- 20.11. Register Description
- 20.11.1. TCCR2 – Timer/Counter Control Register
- 20.11.2. TCNT0 – Timer/Counter Register
- 20.11.3. OCR0 – Output Compare Register
- 20.11.4. ASSR – Asynchronous Status Register
- 20.11.5. TIMSK – Timer/Counter Interrupt Mask Register
- 20.11.6. TIFR – Timer/Counter Interrupt Flag Register
- 20.11.7. SFIOR – Special Function IO Register
- 21. 8-bit Timer/Counter0 with PWM
- 22. SPI – Serial Peripheral Interface
- 23. USART - Universal Synchronous and Asynchronous serial Receiver and Transmitter
- 23.1. Features
- 23.2. Overview
- 23.3. Clock Generation
- 23.4. Frame Formats
- 23.5. USART Initialization
- 23.6. Data Transmission – The USART Transmitter
- 23.7. Data Reception – The USART Receiver
- 23.8. Asynchronous Data Reception
- 23.9. Multi-Processor Communication Mode
- 23.10. Accessing UBRRH/UCSRC Registers
- 23.11. Register Description
- 23.12. Examples of Baud Rate Setting
- 24. TWI - Two-wire Serial Interface
- 25. AC - Analog Comparator
- 26. ADC - Analog to Digital Converter
- 26.1. Features
- 26.2. Overview
- 26.3. Starting a Conversion
- 26.4. Prescaling and Conversion Timing
- 26.5. Changing Channel or Reference Selection
- 26.6. ADC Noise Canceler
- 26.7. ADC Conversion Result
- 26.8. Register Description
- 26.8.1. ADMUX – ADC Multiplexer Selection Register
- 26.8.2. ADCSRA – ADC Control and Status Register A
- 26.8.3. ADCL – ADC Data Register Low (ADLAR=0)
- 26.8.4. ADCH – ADC Data Register High (ADLAR=0)
- 26.8.5. ADCL – ADC Data Register Low (ADLAR=1)
- 26.8.6. ADCH – ADC Data Register High (ADLAR=1)
- 26.8.7. SFIOR – Special Function IO Register
- 27. JTAG Interface and On-chip Debug System
- 27.1. Features
- 27.2. Overview
- 27.3. TAP – Test Access Port
- 27.4. TAP Controller
- 27.5. Using the Boundary-scan Chain
- 27.6. Using the On-chip Debug System
- 27.7. On-chip Debug Specific JTAG Instructions
- 27.8. Using the JTAG Programming Capabilities
- 27.9. Bibliography
- 27.10. IEEE 1149.1 (JTAG) Boundary-scan
- 27.11. Data Registers
- 27.12. Boundry-scan Specific JTAG Instructions
- 27.13. Boundary-scan Chain
- 27.14. ATmega32A Boundary-scan Order
- 27.15. Boundary-scan Description Language Files
- 27.16. Register Description
- 28. BTLDR - Boot Loader Support – Read-While-Write Self-Programming
- 28.1. Features
- 28.2. Overview
- 28.3. Application and Boot Loader Flash Sections
- 28.4. Read-While-Write and No Read-While-Write Flash Sections
- 28.5. Boot Loader Lock Bits
- 28.6. Entering the Boot Loader Program
- 28.7. Addressing the Flash During Self-Programming
- 28.8. Self-Programming the Flash
- 28.8.1. Performing Page Erase by SPM
- 28.8.2. Filling the Temporary Buffer (Page Loading)
- 28.8.3. Performing a Page Write
- 28.8.4. Using the SPM Interrupt
- 28.8.5. Consideration While Updating Boot Loader Section (BLS)
- 28.8.6. Prevent Reading the RWW Section During Self-Programming
- 28.8.7. Setting the Boot Loader Lock Bits by SPM
- 28.8.8. EEPROM Write Prevents Writing to SPMCR
- 28.8.9. Reading the Fuse and Lock Bits from Software
- 28.8.10. Preventing Flash Corruption
- 28.8.11. Programming Time for Flash when Using SPM
- 28.8.12. Simple Assembly Code Example for a Boot Loader
- 28.8.13. ATmega32A Boot Loader Parameters
- 28.9. Register Description
- 29. Memory Programming
- 29.1. Program and Data Memory Lock Bits
- 29.2. Fuse Bits
- 29.3. Signature Bytes
- 29.4. Signature Bytes
- 29.5. Calibration Byte
- 29.6. Parallel Programming Parameters, Pin Mapping, and Commands
- 29.7. Parallel Programming
- 29.7.1. Enter Programming Mode
- 29.7.2. Considerations for Efficient Programming
- 29.7.3. Chip Erase
- 29.7.4. Programming the Flash
- 29.7.5. Programming the EEPROM
- 29.7.6. Reading the Flash
- 29.7.7. Reading the EEPROM
- 29.7.8. Programming the Fuse Low Bits
- 29.7.9. Programming the Fuse High Bits
- 29.7.10. Programming the Lock Bits
- 29.7.11. Reading the Fuse and Lock Bits
- 29.7.12. Reading the Signature Bytes
- 29.7.13. Reading the Calibration Byte
- 29.7.14. Parallel Programming Characteristics
- 29.8. Serial Downloading
- 29.9. Serial Programming Pin Mapping
- 29.10. Programming Via the JTAG Interface
- 29.10.1. Programming Specific JTAG Instructions
- 29.10.2. AVR_RESET (0xC)
- 29.10.3. PROG_ENABLE (0x4)
- 29.10.4. PROG_COMMANDS (0x5)
- 29.10.5. PROG_PAGELOAD (0x6)
- 29.10.6. PROG_PAGEREAD (0x7)
- 29.10.7. Data Registers
- 29.10.8. Reset Register
- 29.10.9. Programming Enable Register
- 29.10.10. Programming Command Register
- 29.10.11. Virtual Flash Page Load Register
- 29.10.12. Virtual Flash Page Read Register
- 29.10.13. Programming Algorithm
- 29.10.14. Entering Programming Mode
- 29.10.15. Leaving Programming Mode
- 29.10.16. Performing Chip Erase
- 29.10.17. Programming the Flash
- 29.10.18. Reading the Flash
- 29.10.19. Programming the EEPROM
- 29.10.20. Reading the EEPROM
- 29.10.21. Programming the Fuses
- 29.10.22. Programming the Lock Bits
- 29.10.23. Reading the Fuses and Lock Bits
- 29.10.24. Reading the Signature Bytes
- 29.10.25. Reading the Calibration Byte
- 30. Electrical Characteristics
- 31. Typical Characteristics
- 31.1. Active Supply Current
- 31.2. Idle Supply Current
- 31.3. Power-down Supply Current
- 31.4. Power-save Supply current
- 31.5. Standby Supply Current
- 31.6. Pin Pull-up
- 31.7. Pin Driver Strength
- 31.8. Pin Thresholds and Hysteresis
- 31.9. BOD Thresholds and Analog Comparator Offset
- 31.10. Internal Oscillator Speed
- 31.11. Current Consumption of Peripheral Units
- 31.12. Current Consumption in Reset and Reset Pulsewidth
- 32. Register Summary
- 33. Instruction Set Summary
- 34. Packaging Information
- 35. Errata
- 36. Datasheet Revision History

held low during input of the 3 LSBs in order to remain in the Shift-IR state. The MSB of the
instruction is shifted in when this state is left by setting TMS high. While the instruction is shifted in
from the TDI pin, the captured IR-state 0x01 is shifted out on the TDO pin. The JTAG Instruction
selects a particular Data Register as path between TDI and TDO and controls the circuitry
surrounding the selected Data Register.
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched onto
the parallel output from the Shift Register path in the Update-IR state. The Exit-IR, Pause-IR, and
Exit2-IR states are only used for navigating the state machine.
• At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift Data
Register – Shift-DR state. While in this state, upload the selected Data Register (selected by the
present JTAG instruction in the JTAG Instruction Register) from the TDI input at the rising edge of
TCK. In order to remain in the Shift-DR state, the TMS input must be held low during input of all bits
except the MSB. The MSB of the data is shifted in when this state is left by setting TMS high. While
the Data Register is shifted in from the TDI pin, the parallel inputs to the Data Register captured in
the Capture-DR state is shifted out on the TDO pin.
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected Data Register
has a latched parallel-output, the latching takes place in the Update-DR state. The Exit-DR, Pause-
DR, and Exit2-DR states are only used for navigating the state machine.
As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting JTAG
instruction and using Data Registers, and some JTAG instructions may select certain functions to be
performed in the Run- Test/Idle, making it unsuitable as an Idle state.
Note: 1. Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can always be
entered by holding TMS high for 5 TCK clock periods.
For detailed information on the JTAG specification, refer to the literature listed in Bibliography.
27.5. Using the Boundary-scan Chain
A complete description of the Boundary-scan capabilities are given in the section IEEE 1149.1 (JTAG)
Boundary-scan.
27.6. Using the On-chip Debug System
As shown in Figure 27-1, the hardware support for On-chip Debugging consists mainly of:
• A scan chain on the interface between the internal AVR CPU and the internal peripheral units
• Break point unit
• Communication interface between the CPU and JTAG system
All read or modify/write operations needed for implementing the Debugger are done by applying AVR
instructions via the internal AVR CPU Scan Chain. The CPU sends the result to an I/O memory mapped
location which is part of the communication interface between the CPU and the JTAG system.
The Break point Unit implements Break on Change of Program Flow, Single Step Break, two Program
Memory Break points, and two combined break points. Together, the four break points can be configured
as either:
• 4 Single Program Memory break points
• 3 Single Program Memory break points + 1 single Data Memory break point
• 2 Single Program Memory break points + 2 single Data Memory break points
Atmel ATmega32A [DATASHEET]
Atmel-8155I-ATmega32A_Datasheet_Complete-08/2016
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