Datasheet
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Description
- 2. Configuration Summary
- 3. Ordering Information
- 4. Block Diagram
- 5. Pin Configurations
- 6. Resources
- 7. Data Retention
- 8. About Code Examples
- 9. Capacitive Touch Sensing
- 10. AVR CPU Core
- 11. AVR Memories
- 12. System Clock and Clock Options
- 13. Power Management and Sleep Modes
- 14. System Control and Reset
- 15. Interrupts
- 16. External Interrupts
- 17. I/O Ports
- 17.1. Overview
- 17.2. Ports as General Digital I/O
- 17.3. Alternate Port Functions
- 17.4. Register Description
- 17.4.1. SFIOR – Special Function IO Register
- 17.4.2. PORTA – Port A Data Register
- 17.4.3. DDRA – Port A Data Direction Register
- 17.4.4. PINA – Port A Input Pins Address
- 17.4.5. PORTB – The Port B Data Register
- 17.4.6. DDRB – The Port B Data Direction Register
- 17.4.7. PINB – The Port B Input Pins Address
- 17.4.8. PORTC – The Port C Data Register
- 17.4.9. DDRC – The Port C Data Direction Register
- 17.4.10. PINC – The Port C Input Pins Address
- 17.4.11. PORTD – The Port D Data Register
- 17.4.12. DDRD – The Port D Data Direction Register
- 17.4.13. PIND – The Port D Input Pins Address
- 18. Timer/Counter0 and Timer/Counter1 Prescalers
- 19. 16-bit Timer/Counter1
- 19.1. Features
- 19.2. Overview
- 19.3. Accessing 16-bit Registers
- 19.4. Timer/Counter Clock Sources
- 19.5. Counter Unit
- 19.6. Input Capture Unit
- 19.7. Output Compare Units
- 19.8. Compare Match Output Unit
- 19.9. Modes of Operation
- 19.10. Timer/Counter Timing Diagrams
- 19.11. Register Description
- 19.11.1. TCCR1A – Timer/Counter1 Control Register A
- 19.11.2. TCCR1B – Timer/Counter1 Control Register B
- 19.11.3. TCNT1L – Timer/Counter1 Low byte
- 19.11.4. TCNT1H – Timer/Counter1 High byte
- 19.11.5. OCR1AL – Output Compare Register 1 A Low byte
- 19.11.6. OCR1AH – Output Compare Register 1 A High byte
- 19.11.7. OCR1BL – Output Compare Register 1 B Low byte
- 19.11.8. OCR1BH – Output Compare Register 1 B High byte
- 19.11.9. ICR1L – Input Capture Register 1 Low byte
- 19.11.10. ICR1H – Input Capture Register 1 High byte
- 19.11.11. TIMSK – Timer/Counter Interrupt Mask Register
- 19.11.12. TIFR – Timer/Counter Interrupt Flag Register
- 20. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 20.1. Features
- 20.2. Overview
- 20.3. Timer/Counter Clock Sources
- 20.4. Counter Unit
- 20.5. Output Compare Unit
- 20.6. Compare Match Output Unit
- 20.7. Modes of Operation
- 20.8. Timer/Counter Timing Diagrams
- 20.9. Asynchronous Operation of the Timer/Counter
- 20.10. Timer/Counter Prescaler
- 20.11. Register Description
- 20.11.1. TCCR2 – Timer/Counter Control Register
- 20.11.2. TCNT0 – Timer/Counter Register
- 20.11.3. OCR0 – Output Compare Register
- 20.11.4. ASSR – Asynchronous Status Register
- 20.11.5. TIMSK – Timer/Counter Interrupt Mask Register
- 20.11.6. TIFR – Timer/Counter Interrupt Flag Register
- 20.11.7. SFIOR – Special Function IO Register
- 21. 8-bit Timer/Counter0 with PWM
- 22. SPI – Serial Peripheral Interface
- 23. USART - Universal Synchronous and Asynchronous serial Receiver and Transmitter
- 23.1. Features
- 23.2. Overview
- 23.3. Clock Generation
- 23.4. Frame Formats
- 23.5. USART Initialization
- 23.6. Data Transmission – The USART Transmitter
- 23.7. Data Reception – The USART Receiver
- 23.8. Asynchronous Data Reception
- 23.9. Multi-Processor Communication Mode
- 23.10. Accessing UBRRH/UCSRC Registers
- 23.11. Register Description
- 23.12. Examples of Baud Rate Setting
- 24. TWI - Two-wire Serial Interface
- 25. AC - Analog Comparator
- 26. ADC - Analog to Digital Converter
- 26.1. Features
- 26.2. Overview
- 26.3. Starting a Conversion
- 26.4. Prescaling and Conversion Timing
- 26.5. Changing Channel or Reference Selection
- 26.6. ADC Noise Canceler
- 26.7. ADC Conversion Result
- 26.8. Register Description
- 26.8.1. ADMUX – ADC Multiplexer Selection Register
- 26.8.2. ADCSRA – ADC Control and Status Register A
- 26.8.3. ADCL – ADC Data Register Low (ADLAR=0)
- 26.8.4. ADCH – ADC Data Register High (ADLAR=0)
- 26.8.5. ADCL – ADC Data Register Low (ADLAR=1)
- 26.8.6. ADCH – ADC Data Register High (ADLAR=1)
- 26.8.7. SFIOR – Special Function IO Register
- 27. JTAG Interface and On-chip Debug System
- 27.1. Features
- 27.2. Overview
- 27.3. TAP – Test Access Port
- 27.4. TAP Controller
- 27.5. Using the Boundary-scan Chain
- 27.6. Using the On-chip Debug System
- 27.7. On-chip Debug Specific JTAG Instructions
- 27.8. Using the JTAG Programming Capabilities
- 27.9. Bibliography
- 27.10. IEEE 1149.1 (JTAG) Boundary-scan
- 27.11. Data Registers
- 27.12. Boundry-scan Specific JTAG Instructions
- 27.13. Boundary-scan Chain
- 27.14. ATmega32A Boundary-scan Order
- 27.15. Boundary-scan Description Language Files
- 27.16. Register Description
- 28. BTLDR - Boot Loader Support – Read-While-Write Self-Programming
- 28.1. Features
- 28.2. Overview
- 28.3. Application and Boot Loader Flash Sections
- 28.4. Read-While-Write and No Read-While-Write Flash Sections
- 28.5. Boot Loader Lock Bits
- 28.6. Entering the Boot Loader Program
- 28.7. Addressing the Flash During Self-Programming
- 28.8. Self-Programming the Flash
- 28.8.1. Performing Page Erase by SPM
- 28.8.2. Filling the Temporary Buffer (Page Loading)
- 28.8.3. Performing a Page Write
- 28.8.4. Using the SPM Interrupt
- 28.8.5. Consideration While Updating Boot Loader Section (BLS)
- 28.8.6. Prevent Reading the RWW Section During Self-Programming
- 28.8.7. Setting the Boot Loader Lock Bits by SPM
- 28.8.8. EEPROM Write Prevents Writing to SPMCR
- 28.8.9. Reading the Fuse and Lock Bits from Software
- 28.8.10. Preventing Flash Corruption
- 28.8.11. Programming Time for Flash when Using SPM
- 28.8.12. Simple Assembly Code Example for a Boot Loader
- 28.8.13. ATmega32A Boot Loader Parameters
- 28.9. Register Description
- 29. Memory Programming
- 29.1. Program and Data Memory Lock Bits
- 29.2. Fuse Bits
- 29.3. Signature Bytes
- 29.4. Signature Bytes
- 29.5. Calibration Byte
- 29.6. Parallel Programming Parameters, Pin Mapping, and Commands
- 29.7. Parallel Programming
- 29.7.1. Enter Programming Mode
- 29.7.2. Considerations for Efficient Programming
- 29.7.3. Chip Erase
- 29.7.4. Programming the Flash
- 29.7.5. Programming the EEPROM
- 29.7.6. Reading the Flash
- 29.7.7. Reading the EEPROM
- 29.7.8. Programming the Fuse Low Bits
- 29.7.9. Programming the Fuse High Bits
- 29.7.10. Programming the Lock Bits
- 29.7.11. Reading the Fuse and Lock Bits
- 29.7.12. Reading the Signature Bytes
- 29.7.13. Reading the Calibration Byte
- 29.7.14. Parallel Programming Characteristics
- 29.8. Serial Downloading
- 29.9. Serial Programming Pin Mapping
- 29.10. Programming Via the JTAG Interface
- 29.10.1. Programming Specific JTAG Instructions
- 29.10.2. AVR_RESET (0xC)
- 29.10.3. PROG_ENABLE (0x4)
- 29.10.4. PROG_COMMANDS (0x5)
- 29.10.5. PROG_PAGELOAD (0x6)
- 29.10.6. PROG_PAGEREAD (0x7)
- 29.10.7. Data Registers
- 29.10.8. Reset Register
- 29.10.9. Programming Enable Register
- 29.10.10. Programming Command Register
- 29.10.11. Virtual Flash Page Load Register
- 29.10.12. Virtual Flash Page Read Register
- 29.10.13. Programming Algorithm
- 29.10.14. Entering Programming Mode
- 29.10.15. Leaving Programming Mode
- 29.10.16. Performing Chip Erase
- 29.10.17. Programming the Flash
- 29.10.18. Reading the Flash
- 29.10.19. Programming the EEPROM
- 29.10.20. Reading the EEPROM
- 29.10.21. Programming the Fuses
- 29.10.22. Programming the Lock Bits
- 29.10.23. Reading the Fuses and Lock Bits
- 29.10.24. Reading the Signature Bytes
- 29.10.25. Reading the Calibration Byte
- 30. Electrical Characteristics
- 31. Typical Characteristics
- 31.1. Active Supply Current
- 31.2. Idle Supply Current
- 31.3. Power-down Supply Current
- 31.4. Power-save Supply current
- 31.5. Standby Supply Current
- 31.6. Pin Pull-up
- 31.7. Pin Driver Strength
- 31.8. Pin Thresholds and Hysteresis
- 31.9. BOD Thresholds and Analog Comparator Offset
- 31.10. Internal Oscillator Speed
- 31.11. Current Consumption of Peripheral Units
- 31.12. Current Consumption in Reset and Reset Pulsewidth
- 32. Register Summary
- 33. Instruction Set Summary
- 34. Packaging Information
- 35. Errata
- 36. Datasheet Revision History

26.5.2. ADC Voltage Reference
The reference voltage for the ADC (V
REF
) indicates the conversion range for the ADC. Single ended
channels that exceed V
REF
will result in codes close to 0x3FF. V
REF
can be selected as either AV
CC
,
internal 2.56V reference, or external AREF pin.
AV
CC
is connected to the ADC through a passive switch. The internal 2.56V reference is generated from
the internal bandgap reference (V
BG
) through an internal amplifier. In either case, the external AREF pin
is directly connected to the ADC, and the reference voltage can be made more immune to noise by
connecting a capacitor between the AREF pin and ground. V
REF
can also be measured at the AREF pin
with a high impedance voltmeter. Note that V
REF
is a high impedance source, and only a capacitive load
should be connected in a system.
If the user has a fixed voltage source connected to the AREF pin, the user may not use the other
reference voltage options in the application, as they will be shorted to the external voltage. If no external
voltage is applied to the AREF pin, the user may switch between AV
CC
and 2.56V as reference selection.
The first ADC conversion result after switching reference voltage source may be inaccurate, and the user
is advised to discard this result.
If differential channels are used, the selected reference should not be closer to AV
CC
than indicated in
table ADC Characteristics, Differential Channels in ADC Characteristics
Related Links
ADC Characteristics on page 367
26.6. ADC Noise Canceler
The ADC features a noise canceler that enables conversion during sleep mode to reduce noise induced
from the CPU core and other I/O peripherals. The noise canceler can be used with ADC Noise Reduction
and Idle mode. To make use of this feature, the following procedure should be used:
1. Make sure that the ADC is enabled and is not busy converting. Single Conversion mode must be
selected and the ADC conversion complete interrupt must be enabled.
2. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion once the CPU
has been halted.
3. If no other interrupts occur before the ADC conversion completes, the ADC interrupt will wake up
the CPU and execute the ADC Conversion Complete interrupt routine. If another interrupt wakes up
the CPU before the ADC conversion is complete, that interrupt will be executed, and an ADC
Conversion Complete interrupt request will be generated when the ADC conversion completes. The
CPU will remain in active mode until a new sleep command is executed.
Note: The ADC will not be automatically turned off when entering other sleep modes than Idle mode and
ADC Noise Reduction mode. The user is advised to write zero to ADCRSA.ADEN before entering such
sleep modes to avoid excessive power consumption. If the ADC is enabled in such sleep modes and the
user wants to perform differential conversions, the user is advised to switch the ADC off and on after
waking up from sleep to prompt an extended conversion to get a valid result.
26.6.1. Analog Input Circuitry
The analog input circuitry for single ended channels is illustrated below. An analog source applied to
ADCn is subjected to the pin capacitance and input leakage of that pin, regardless of whether that
channel is selected as input for the ADC. When the channel is selected, the source must drive the S/H
capacitor through the series resistance (combined resistance in the input path).
The ADC is optimized for analog signals with an output impedance of approximately 10kΩ or less. If such
a source is used, the sampling time will be negligible. If a source with higher impedance is used, the
Atmel ATmega32A [DATASHEET]
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