Datasheet

37. Packaging Information
37.1 32A
© 2007 Microchip Technology Inc. DS00049AR-page 131
M
Packaging Diagrams and Parameters
32-Lead Plastic Thin Quad Flatpack (PT) – 7x7x1.0 mm Body, 2.00 mm [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Leads N 32
Lead Pitch e 0.80 BSC
Overall Height A – – 1.20
Standoff A1 0.05 – 0.15
Molded Package Thickness A2 0.95 1.00 1.05
Foot Length L 0.45 0.60 0.75
Footprint L1 1.00 REF
Foot Angle
φ 0° 3.5° 7°
Overall Width E 9.00 BSC
Overall Length D 9.00 BSC
Molded Package Width E1 7.00 BSC
Molded Package Length D1 7.00 BSC
Lead Thickness c 0.09 – 0.20
Lead Width b 0.30 0.37 0.45
Mold Draft Angle Top α 11° 12° 13°
Mold Draft Angle Bottom β 11° 12° 13°
φ
α
β
D
D1
E
E1
A1
A
A2
L1
L
c
NOTE 2
NOTE 1
e
b
N
1 2 3
Microchip Technology Drawing C04-074B
ATmega328PB
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40001906C-page 454