Datasheet

ATF196V8B(Q)(QL) [DATASHEET]
Atmel-0364K-PLD-ATF16V8B-8BQ-8BQL-Datasheet_072014
22
13.2 20X — 20-lead TSSOP
DRAWING NO. REV. TITLE
GPC
20X D
TLN
Package Drawing Contact:
[e-mail]
09/26/11
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 6.40 6.50 6.60 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20
A2 0.80 1.00 1.05
b 0.19 – 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF
Notes: 1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AC, for additional
information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot.
Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
L1
A
L
D
A2
E
E1
e
b
Top Vi ew
Side View
End View
0º~ 8º
20X, 20-lead 4.4 x 6.5 mm Body, 0.65 mm
Lead Pitch, Thin Shrink Small Outline Package
(TSSOP)