Datasheet

 2017 Microchip Technology Inc. DS60001516A-page 771
SAM9G20
41.2.1 Soldering Profile – 247-ball TFBGA
Table 41-5 gives the recommended soldering profile from J-STD-20.
Note: It is recommended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
Table 41-8: Device and 247-ball TFBGA Package Maximum Weight
177 mg
Table 41-9: 247-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 41-10: 247-ball TFBGA Package Reference
JEDEC Drawing Reference none
JESD97 Classification e1
Table 41-11: Soldering Profile – 247-ball TFBGA
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260 +0°C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.