Datasheet

SAM9G20
DS60001516A-page 768  2017 Microchip Technology Inc.
41. Mechanical Characteristics
41.1 217-ball LFBGA Package Drawing
Figure 41-1: 217-ball LFBGA Package Drawing
Table 41-1: 217-ball LFBGA Soldering Information
Ball Land 0.43 mm +/- 0.05
Soldering Mask Opening 0.30 mm +/- 0.05
Table 41-2: Device and 217-ball LFBGA Package Maximum Weight
450 mg
Table 41-3: 217-ball LFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 41-4: 217-ball LFBGA Package Reference
JEDEC Drawing Reference MO-205
JESD97 Classification e1