Datasheet
SAM9G20
DS60001516A-page 12 ļ£ 2017 Microchip Technology Inc.
3.3 247-ball TFBGA Package Outline
Figure 3-2 shows the orientation of the 247-ball TFBGA package.
A detailed mechanical description is given in Section 41.2 ā247-ball TFBGA Package Drawingā.
Figure 3-2: 247-ball TFBGA Package (Top View)
3.4 247-ball TFBGA Package Pinout
C17 SHDN J3 VDDIOM P12 PA3 U16 PA18
D1 D9 J4 PC16 P13 PA7 U17 VDDIOP
D2 D2 J8 GND P14 PA9
D3 RAS J9 GND P15 PA26
D4 D0 J10 GND P16 PA25
Table 3-2: Pinout for 247-ball TFBGA Package
Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name
A1 D13 F7 CFIOR/NBS1/NWR1 K10 GND P17 RTCK
A2 D12 F8 SDA10 K11 VDDIOM P18 PB16
A12 A9 F9 NBS0/A0 K12 GND R2 GND
A14 A13 F10 A6 K13 GND R3 PB29
A16 A20 F11 A12 K14 XOUT32 R5 PB26
A18 A22 F12 A15 K15 XIN32 R6 PB27
A19 NANDOE F13 BA1/A17 K17 HDPA R7 PA5
B1 D15 F14 PC10 K18 HDMA R8 GND
B2 D14 F15 PC14 L2 NC R9 PA12
B3 D10 F16 VDDUSB L3 NC R10 GND
Table 3-1: Pinout for 217-ball LFBGA Package (Continued)
Pin Signal Name Pin Signal Name Pin Signal Name Pin Signal Name
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
Ball A1