Datasheet

SAM9263 [DATASHEET]
Atmel-6249N-ATARM-SAM9263-Datasheet_14-Mar-16
1054
47.2 Package Drawing AT91SAM9263B-CU-100
Figure 47-2. 324-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 47-6. Soldering Information
Ball Land 0.4 mm +/- 0.05
Solder Mask Opening 0.275 mm +/- 0.03
Table 47-7. Device and 324-ball TFBGA Package Maximum Weight
572 mg
Table 47-8. 324-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 47-9. Package Reference
JEDEC Drawing Reference MO-275
JESD97 Classification e8