Datasheet

SAM9263 [DATASHEET]
Atmel-6249N-ATARM-SAM9263-Datasheet_14-Mar-16
1052
47. SAM9263 Mechanical Characteristics
47.1 Package Drawing AT91SAM9263B-CU
Note: Device AT91SAM9263B-CU is no longer available.
Figure 47-1. 324-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 47-1. Soldering Information
Ball Land 0.4 mm +/- 0.05
Soldering Mask Opening 0.275 mm +/- 0.03
Table 47-2. Device and 324-ball TFBGA Package Maximum Weight
572 mg
Table 47-3. 324-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 47-4. Package Reference
JEDEC Drawing Reference MO-210
JESD97 Classification e1