Datasheet

SAM9261 [DATASHEET]
Atmel-6062O-ATARM-SAM9261-Datasheet_21-Jun-16
696
39. Mechanical Characteristics
39.1 Package Drawings
Figure 39-1. 217-ball LFBGA Package Drawing
Table 39-1. Soldering Information (Substrate Level)
Ball Land 0.43 mm ± 0.05
Solder Mask Opening 0.30 mm ± 0.05
Table 39-2. Device and 217-ball LFBGA Package Maximum Weight
450 mg
Table 39-3. 217-ball LFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 39-4. Package Reference
JEDEC Drawing Reference MO-205
J-STD-609 Category e1