Datasheet
Table Of Contents
- 1. Description
- 2. About Code Examples
- 3. AVR CPU Core
- 4. Memories
- 5. System Clock
- 6. Power Management and Sleep Modes
- 7. System Control and Reset
- 8. Interrupts
- 9. I/O-Ports
- 10. External Interrupts
- 11. Timer/Counter3/1/0 Prescalers
- 12. 8-bit Timer/Counter0 with PWM
- 13. 16-bit Timer/Counter (Timer/Counter1 and Timer/Counter3)
- 14. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 14.1 Features
- 14.2 Overview
- 14.3 Timer/Counter Clock Sources
- 14.4 Counter Unit
- 14.5 Output Compare Unit
- 14.6 Compare Match Output Unit
- 14.7 Modes of Operation
- 14.8 Timer/Counter Timing Diagrams
- 14.9 8-bit Timer/Counter Register Description
- 14.10 Asynchronous operation of the Timer/Counter2
- 14.11 Timer/Counter2 Prescaler
- 15. Output Compare Modulator - OCM
- 16. Serial Peripheral Interface - SPI
- 17. USART (USART0 and USART1)
- 17.1 Features
- 17.2 Overview
- 17.3 Dual USART
- 17.4 Clock Generation
- 17.5 Serial Frame
- 17.6 USART Initialization
- 17.7 Data Transmission - USART Transmitter
- 17.8 Data Reception - USART Receiver
- 17.9 Asynchronous Data Reception
- 17.10 Multi-processor Communication Mode
- 17.11 USART Register Description
- 17.12 Examples of Baud Rate Setting
- 18. Two-wire Serial Interface
- 19. Controller Area Network - CAN
- 20. Analog Comparator
- 21. Analog to Digital Converter - ADC
- 22. JTAG Interface and On-chip Debug System
- 23. Boundary-scan IEEE 1149.1 (JTAG)
- 24. Boot Loader Support - Read-While-Write Self-Programming
- 25. Memory Programming
- 26. Electrical Characteristics (1)
- 26.1 Absolute Maximum Ratings*
- 26.2 DC Characteristics
- 26.3 External Clock Drive Characteristics
- 26.4 Maximum Speed vs. VCC
- 26.5 Two-wire Serial Interface Characteristics
- 26.6 SPI Timing Characteristics
- 26.7 CAN Physical Layer Characteristics
- 26.8 ADC Characteristics
- 26.9 External Data Memory Characteristics
- 26.10 Parallel Programming Characteristics
- 27. Decoupling Capacitors
- 28. AT90CAN32/64/128 Typical Characteristics
- 28.1 Active Supply Current
- 28.2 Idle Supply Current
- 28.3 Power-down Supply Current
- 28.4 Power-save Supply Current
- 28.5 Standby Supply Current
- 28.6 Pin Pull-up
- 28.7 Pin Driver Strength
- 28.8 Pin Thresholds and Hysteresis
- 28.9 BOD Thresholds and Analog Comparator Offset
- 28.10 Internal Oscillator Speed
- 28.11 Current Consumption of Peripheral Units
- 28.12 Current Consumption in Reset and Reset Pulse Width
- 29. Register Summary
- 30. Instruction Set Summary
- 31. Ordering Information
- 32. Packaging Information
- 33. Errata
- 34. Datasheet Revision History for AT90CAN32/64/128
- 34.1 Changes from 7679G - 03/08 to 7679H - 08/08
- 34.2 Changes from 7679F - 11/07 to 7679G - 03/08
- 34.3 Changes from 7679E - 07/07 to 7679F - 11/07
- 34.4 Changes from 7679D - 02/07 to 7679E - 07/07
- 34.5 Changes from 7679C - 01/07 to 7679D - 02/07
- 34.6 Changes from 7679B - 11/06 to 7679C - 01/07
- 34.7 Changes from 7679A - 10/06 to 7679B - 11/06
- 34.8 Document Creation

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7679H–CAN–08/08
AT90CAN32/64/128
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. The instruction is latched
onto the parallel output from the Shift Register path in the Update-IR state. The Exit-IR,
Pause-IR, and Exit2-IR states are only used for navigating the state machine.
• At the TMS input, apply the sequence 1, 0, 0 at the rising edges of TCK to enter the Shift
Data Register – Shift-DR state. While in this state, upload the selected data register (selected
by the present JTAG instruction in the JTAG Instruction Register) from the TDI input at the
rising edge of TCK. In order to remain in the Shift-DR state, the TMS input must be held low
during input of all bits except the MSB. The MSB of the data is shifted in when this state is left
by setting TMS high. While the data register is shifted in from the TDI pin, the parallel inputs
to the data register captured in the Capture-DR state is shifted out on the TDO pin.
• Apply the TMS sequence 1, 1, 0 to re-enter the Run-Test/Idle state. If the selected data
register has a latched parallel-output, the latching takes place in the Update-DR state. The
Exit-DR, Pause-DR, and Exit2-DR states are only used for navigating the state machine.
As shown in the state diagram, the Run-Test/Idle state need not be entered between selecting
JTAG instruction and using data registers, and some JTAG instructions may select certain func-
tions to be performed in the Run-Test/Idle, making it unsuitable as an Idle state.
Note: Independent of the initial state of the TAP Controller, the Test-Logic-Reset state can always be
entered by holding TMS high for five TCK clock periods.
For detailed information on the JTAG specification, refer to the literature listed in “Bibliography”
on page 299.
22.5 Using the Boundary-scan Chain
A complete description of the Boundary-scan capabilities are given in the section “Boundary-
scan IEEE 1149.1 (JTAG)” on page 300.
22.6 Using the On-chip Debug System
As shown in Figure 22-1, the hardware support for On-chip Debugging consists mainly of
• A scan chain on the interface between the internal AVR CPU and the internal peripheral
units.
• Break Point unit.
• Communication interface between the CPU and JTAG system.
All read or modify/write operations needed for implementing the Debugger are done by applying
AVR instructions via the internal AVR CPU Scan Chain. The CPU sends the result to an I/O
memory mapped location which is part of the communication interface between the CPU and the
JTAG system.
The Break Point Unit implements Break on Change of Program Flow, Single Step Break, two
Program Memory Break Points, and two combined Break Points. Together, the four Break
Points can be configured as either:
• 4 single Program Memory Break Points.
• 3 single Program Memory Break Points + 1 single Data Memory Break Point.
• 2 single Program Memory Break Points + 2 single Data Memory Break Points.