Datasheet

1289
32117D–AVR-01/12
AT32UC3C
41.2 Package Drawings
Figure 41-1. QFN-64 package drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 41-2. Device and Package Maximum Weight
200 mg
Table 41-3. Package Characteristics
Moisture Sensitivity Level Jdec J-STD0-20D - MSL 3
Table 41-4. Package Reference
JEDEC Drawing Reference MS-026
JESD97 Classification E3