Datasheet

temperature. The targeted solder joint temperature for the Sn-Ag-Cu solder should be ~235°C. For larger
or sophisticated boards with a large mix of components, it is also important to ensure that the
temperature difference across the board is less than 10 degrees to minimize board warpage. The
maximum temperature at the component body should not exceed the MSL3 qualification specification.
13.4.1 Reflow Oven
The following items should also be observed in the reflow process:
1. Allowable reflow soldering iterations:
Three times based on the following reflow soldering profile (refer following Figure).
2. Temperature profile:
Reflow soldering shall be done according to the following temperature profile (refer to the
following figure).
Peak temperature: 250°C.
Figure 13-1. Solder Reflow Profile
25
o
C
Slope: 1~2
o
C/sec max.
(217
o
C to peak)
(Peak: 250
o
C)
Ramp down rate:
Max. 2.5
o
C/sec.
Time (sec)
40 ~ 70 sec.
60 ~ 120 sec.
Ramp up rate:
Max. 2.5
o
C/sec.
Preheat:150 ~ 200
o
C
217
o
C
Cleaning
The exposed ground paddle helps to self-align the module, avoiding pad misalignment. The use of no
clean solder pastes is recommended. Full drying of no-clean paste fluxes as a result of the reflow process
must be ensured. This may require longer reflow profiles and/or peak temperatures toward the high end
of the process window as recommended by the solder paste vendor. It is believed that uncured flux
residues could lead to corrosion and/or shorting in accelerated testing and possibly the field.
Rework
Rework is to remove the mounted SIP package and replace with a new unit. It is recommended that once
an ATWINC15x0-MR210xB Module has been removed it should never be reused. During the rework
process, the mounted module and PCB are heated partially, and the module is removed. It is
ATWINC15x0
Reflow Profile Information
© 2018 Microchip Technology Inc.
Datasheet
DS70005304C-page 38