Datasheet

Figure 11-3. Module Solder Pad Footprint (unit = mm).
NOTE: THIS PAD MUST BE
TIED TO GND.
1.016 Pitch
14.73
1.9
0.8
1.016 Pitch
4.064
2.67
2.67
6.00
1.016 Pitch
3.70
3.70
1.016 Pitch
1.9
3.048
3.68
21.72
2.032
4.42
SOLDER PAD FOOTPRINT
Drawing not to scale.
Untoleranced dimensions.
Units=mm.
ATWINC15x0
Module Drawing
© 2018 Microchip Technology Inc.
Datasheet
DS70005304C-page 31