Datasheet
2003 Microchip Technology Inc. DS21189H-page23
24AA64/24LC64
PRODUCT IDENTIFICATION SYSTEM
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Data Sheets
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PART NO. X /XX
PackageTemperature
Range
Device
Device: 24AA64: 1.8V, 64 Kbit I
2
C Serial EEPROM
24AA64T: 1.8V, 64 Kbit I
2
C Serial EEPROM
(Tape and Reel)
24AA64X 1.8V, 64 Kbit I
2
C Serial EEPROM in rotated
pinout (ST only)
24AA64XT 1.8V, 64 Kbit I
2
C Serial EEPROM in rotated
pinout (ST only)
24LC64: 2.5V, 64 Kbit I
2
C Serial EEPROM
24LC64T: 2.5V, 64 Kbit I
2
C Serial EEPROM
(Tape and Reel)
24LC64X 2.5V, 64 Kbit I
2
C Serial EEPROM in rotated
pinout (ST only)
24LC64XT 2.5V, 64 Kbit I
2
C Serial EEPROM in rotated
pinout (ST only)
Temperature
Range:
I = -40°C to +85°C
E = -40°C to +125°C
Package:
Lead Finish
P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (150 mil body), 8-lead
SM = Plastic SOIC (208 mil body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
Blank= Standard 63/37 Sn/Pb
G = Matte Tin (pure Sn)
Examples:
a) 24AA64-I/P: Industrial Temperature,
1.8V, PDIP package
b) 24AA64-I/SN: Industrial Temperature,
1.8V, SOIC package
c) 24AA64-I/SM: Industrial Temperature,
1.8V,
SOIC (208 mil) package
d) 24AA64X-I/ST: Industrial Temperature,
1.8V, Rotated TSSOP package
e) 24AA64T-I/ST: Industrial Temperature,
1.8V, TSSOP package, tape and reel
f)
24LC64-I/P: Industrial Temperature,
2.5V, PDIP package
g) 24LC64-E/SN: Extended Temperature,
2.5V, SOIC package
h) 24LC64-E/SM: Extended Temperature,
2.5V,
SOIC (208 mil) package
i) 24LC64XT-I/ST : Extended Temperature,
2.5V, Rotated TSSOP package, tape and
reel
j) 24LC64-I/ST: Industrial Temperature,
2.5V, TSSOP package
k) 24AA64-I/PG: Industrial Temperature, 1.8V,
PDIP package, Pb-free
l) 24LC64T-I/SNG: Industrial Temperature,
2.5V, SOIC package, tape and reel, Pb-free
X X
Lead Finish