Datasheet

24AA32A/24LC32A
DS21713M-page 38  2002-2012 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision D (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Revision E (03/2005)
Added DFN package.
Revision F (08/2005)
Revised Sections 4.3, 7.2 and 7.4.
Revision G (07/2006)
Replaced 2x3 DFN (MC) Package
Revision H (02/2007)
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Deleted Rotated
TSSOP; Revised Product ID Section.
Revision J (02/2009)
Added TDFN and SOT-23 packages; Updated
Package Drawings; Moved Pin Descriptions to Section
2.0; Renumbered Sections.
Revision K (12/2009)
Added Chip Scale Package.
Revision L (03/2010)
Added X-Rotated TSSOP package; Updated Package
Drawings.
Revision M (02/2012)
Corrected CS package drawing aspect ratio; Revised
Product ID System.