Datasheet

 2004 Microchip Technology Inc. DS21203M-page 25
24AA256/24LC256/24FC256
PRODUCT IDENTIFICATION SYSTEM
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PART NO. X /XX
PackageTemperature
Range
Device
Device: 24AA256: 256 Kbit 1.8V I
2
C Serial
EEPROM
24AA256T: 256 Kbit 1.8V I
2
C Serial
EEPROM Tape and Reel)
24LC256: 256 Kbit 2.5V I
2
C Serial
EEPROM
24LC256T: 256 Kbit 2.5V I
2
C Serial
EEPROM Tape and Reel)
24FC256: 256 Kbit High Speed I
2
C Serial
EEPROM
24FC256T: 256 Kbit High Speed I
2
C Serial
EEPROM Tape and Reel)
Temperature
Range:
I= -40°C to +85°C
E= -40°C to +125°C
Package: P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (150 mil body), 8-lead
SM = Plastic SOIC (208 mil body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
ST14 = Plastic TSSOP (4.4 mm), 14-lead
MF = Dual, Flat, No Lead (DFN)(6x5 mm
body), 8-lead
MS = Plastic Micro Small Outline (MSOP),
8-lead
Lead Finish Blank= Standard 63%/37% Sn/Pb
G = Pb-free (Pure Matte Sn)
Examples:
a) 24AA256-I/P: Industrial Temp.,
1.8V, PDIP package.
b) 24AA256T-I/SN: Tape and Reel,
Industrial Temp., 1.8V, SOIC
package.
c) 24AA256-I/ST: Industrial Temp.,
1.8V, TSSOP package.
d) 24AA256-I/MS: Industrial Temp.,
1.8V, MSOP package.
e) 24LC256-E/P: Extended Temp.,
2.5V, PDIP package.
f) 24LC256-I/SN: Industrial Temp.,
2.5V, SOIC package.
g) 24LC256T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
h) 24LC256-I/MS: Industrial Temp,
2.5V, MSOP package.
i) 24FC256-I/P: Industrial Temp,
1.8V, High Speed, PDIP package.
j) 24FC256-I/SN: Industrial Temp,
1.8V, High Speed, SOIC package.
k) 24FC256T-I/SN: Tape and Reel,
Industrial Temp, 1.8V, High Speed,
SOIC package
l) 24LC256T-I/STG: Industrial Temp,
2.5V, TSSOP package, Tape & Reel,
Pb-free
m) 24LC256-I/PG: Industrial Temp,
2.5V, PDIP package, Pb-free
X
Lead
Finish