Datasheet

ManualsBrandsMicrochip ManualsEEPROMEEPROM 128KB 900ns NSOIC

 2004 Microchip Technology Inc. DS21191M-page 1

24AA128/24LC128/24FC128

Device Selection Table

Features

• Low-power CMOS technology:

- Maximum write current 3 mA at 5.5V

- Maximum read current 400 µA at 5.5V

- Standby current 100 nA typical at 5.5V

• 2-wire serial interface bus, I

C™ compatible

• Cascadable for up to eight devices

• Self-timed erase/write cycle

• 64-byte Page Write mode available

• 5 ms max write cycle time

• Hardware write-protect for entire array

• Output slope control to eliminate ground bounce

• Schmitt Trigger inputs for noise suppression

• 1,000,000 erase/write cycles

• Electrostatic discharge protection > 4000V

• Data retention > 200 years

• 8-pin PDIP, SOIC, TSSOP, MSOP and DFN

packages, 14-lead TSSOP package

• Standard and Pb-free finishes available

• Temperature ranges:

Description

The Microchip Technology Inc. 24AA128/24LC128/

24FC128 (24XX128*) is a 16K x 8 (128 Kbit) Serial

Electrically Erasable PROM (EEPROM), capable of

operation across a broad voltage range (1.8V to 5.5V).

It has been developed for advanced, low-power

applications such as personal communications or data

acquisition. This device also has a page write capabil-

ity of up to 64 bytes of data. This device is capable of

both random and sequential reads up to the 128K

boundary. Functional address lines allow up to eight

devices on the same bus, for up to 1 Mbit address

space. This device is available in the standard 8-pin

plastic DIP, SOIC (150 and 208 mil), TSSOP, MSOP,

DFN and 14-lead TSSOP packages.

Block Diagram

Package Types

*24XX128 is used in this document as a generic part number for the 24AA128/24LC128/24FC128 devices.

Part

Number

VCC

Range

Max. Clock

Frequency

Temp.

Ranges

24AA128 1.8-5.5V 400 kHz

(1)

24LC128 2.5-5.5V 400 kHz I, E

24FC128 1.8-5.5V 1 MHz

(2)

Note 1: 100 kHz for VCC < 2.5V.

2: 400 kHz for VCC < 2.5V.

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

HV Generator

EEPROM

Array

Page Latches

YDEC

XDEC

Sense Amp.

R/W

Control

Memory

Control

Logic

I/O

ontrol

Logic

I/O

A0 A1 A2

SDA

SCL

VSS

VCC

SCL

SDA

24XX128

PDIP/SOIC TSSOP/MSOP *

SCL

SDA

TSSOP

24XX128

DFN

SCL

SDA

24XX128

VCC

SCL

SDA

24XX128

Note: * Pins A0 and A1 are no-connects for the MSOP package only.

128K I

™

CMOS Serial EEPROM

Summary of content (27 pages)

PAGE 1
24AA128/24LC128/24FC128 128K I2C™ CMOS Serial EEPROM Device Selection Table Description Part Number VCC Range Max. Clock Frequency Temp. Ranges 24AA128 1.8-5.5V 400 kHz(1) I 24LC128 2.5-5.5V 400 kHz I, E 1.8-5.5V (2) 24FC128 Note 1: 2: 1 MHz The Microchip Technology Inc. 24AA128/24LC128/ 24FC128 (24XX128*) is a 16K x 8 (128 Kbit) Serial Electrically Erasable PROM (EEPROM), capable of operation across a broad voltage range (1.8V to 5.5V).
PAGE 2
4AA128/24LC128/24FC128 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC .............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V Storage temperature ..................................................................
PAGE 3
24AA128/24LC128/24FC128 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param. No. Sym. Characteristic Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C Min. Max. Units Conditions 1 FCLK Clock frequency — — — — 100 400 400 1000 kHz 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC128 2.5V ≤ VCC ≤ 5.5V 24FC128 2 THIGH Clock high time 4000 600 600 500 — — — — ns 1.8V ≤ VCC < 2.5V 2.
PAGE 4
24AA128/24LC128/24FC128 TABLE 1-2: AC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Industrial (I): VCC = +1.8V to 5.5V TA = -40°C to +85°C Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to 125°C AC CHARACTERISTICS Param. No. Sym. Characteristic Min. Max. Units Conditions 4700 1300 1300 — — — ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 24FC128 — — — — 3500 900 900 400 ns 1.8V ≤ VCC < 2.5V 2.5V ≤ VCC ≤ 5.5V 1.8V ≤ VCC < 2.5V 24FC128 2.5V ≤ VCC ≤ 5.
PAGE 5
24AA128/24LC128/24FC128 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
PAGE 6
24AA128/24LC128/24FC128 4.0 BUS CHARACTERISTICS The data on the line must be changed during the low period of the clock signal. There is one bit of data per clock pulse. The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition.
PAGE 7
24AA128/24LC128/24FC128 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device (Figure 5-1). The control byte consists of a 4-bit control code. For the 24XX128, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24XX128 devices on the same bus and are used to select which device is accessed.
PAGE 8
24AA128/24LC128/24FC128 6.0 WRITE OPERATIONS 6.1 Byte Write master should transmit more than 64 bytes prior to generating the Stop condition, the address counter will roll over and the previously received data will be overwritten. As with the byte write operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2).
PAGE 9
24AA128/24LC128/24FC128 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (This feature can be used to maximize bus throughput). Once the Stop condition for a Write command has been issued from the master, the device initiates the internally timed write cycle. ACK polling can be initiated immediately. This involves the master sending a Start condition, followed by the control byte for a Write command (R/W = 0).
PAGE 10
24AA128/24LC128/24FC128 8.0 READ OPERATION 8.2 Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is done by sending the word address to the 24XX128 as part of a write operation (R/W bit set to ‘0’). Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal address pointer is set.
PAGE 11
24AA128/24LC128/24FC128 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX T/XXYYWW NNN 8-Lead SOIC (208 mil) XXXXXXXX T/XXXXXX YYWWNNN 8-Lead TSSOP XXXX TYWW NNN  2004 Microchip Technology Inc.
PAGE 12
24AA128/24LC128/24FC128 Package Marking Information (Continued) 8-Lead MSOP Example: XXXXXT 4L128I YWWNNN 101017 8-Lead DFN-S Example: 24LC128 I/MF YYWW NNN XXXXXXX T/XXXXX YYWW NNN 14-Lead TSSOP Example: XXXXXXXT YYWW NNN Legend: XX...
PAGE 13
24AA128/24LC128/24FC128 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) E1 D 2 n 1 α E A2 A L c A1 β B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c
PAGE 14
24AA128/24LC128/24FC128 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 α h 45° c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L φ c B α β MIN .053 .052 .004 .228 .146 .
PAGE 15
24AA128/24LC128/24FC128 8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC) E E1 p D 2 1 n B α c A2 A φ β L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L φ c B α β MIN .070 .069 .002 .300 .201 .202 .020 0 .008 .014 0 0 INCHES* NOM 8 .050 .075 .074 .005 .313 .208 .205 .025 4 .
PAGE 16
24AA128/24LC128/24FC128 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 A2 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN INCHES NOM MAX 8 .026 .033 .002 .246 .
PAGE 17
24AA128/24LC128/24FC128 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) E E1 p D 2 1 n B α A c φ β A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L φ c B α β MIN .033 .002 .246 .169 .193 .020 0 .004 .
PAGE 18
24AA128/24LC128/24FC128 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN 8 Number of Pins Pitch .026 BSC A .043 Overall Height A2 Molded Package Thickness .030 .033 .037 A1 .000 .006 Standoff E Overall Width .193 TYP. E1 .118 BSC Molded Package Width D .118 BSC Overall Length L .016 .024 .
PAGE 19
24AA128/24LC128/24FC128 8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) E p B E1 n L R D1 1 D D2 PIN 1 ID EXPOSED METAL PADS 2 E2 TOP VIEW BOTTOM VIEW α A2 A3 A A1 INCHES Units Dimension Limits Number of Pins MIN MILLIMETERS* NOM n MAX MIN NOM MAX 8 8 Pitch p Overall Height A .033 .039 0.85 1.00 Molded Package Thickness A2 .026 .031 0.65 0.80 Standoff A1 .0004 .002 0.01 0.05 Base Thickness A3 .008 REF. 0.20 REF. 4.92 BSC .050 BSC .
PAGE 20
24AA128/24LC128/24FC128 APPENDIX A: REVISION HISTORY Revision L Corrections to Section 1.0, Electrical Characteristics. Revision M Added 1.8V 400 kHz option for 24FC128. DS21191M-page 20  2004 Microchip Technology Inc.
PAGE 21
24AA128/24LC128/24FC128 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape® or Microsoft® Internet Explorer. Files are also available for FTP download from our FTP site.
PAGE 22
24AA128/24LC128/24FC128 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document.
PAGE 23
24AA128/24LC128/24FC128 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X Device Device: Temperature Range 24AA128: 24AA128T: 24LC128: 24LC128T: 24FC128: 24FC128T: Temperature Range: I E Package: P = SN = SM = ST = ST14 = MF = MS Lead Finish = = /XX X Package Lead Finish 128 Kbit 1.8V I2C Serial EEPROM 128 Kbit 1.8V I2C Serial EEPROM (Tape and Reel) 128 Kbit 2.
PAGE 24
AA128/24LC128/24FC128 NOTES: DS21191M-page24  2004 Microchip Technology Inc.
PAGE 25
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 26
WORLDWIDE SALES AND SERVICE AMERICAS China - Beijing Korea Corporate Office Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Chengdu 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 2355 West Chandler Blvd.
PAGE 27
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