Datasheet

 2007-2019 Microchip Technology Inc. DS20001709L-page 41
24AA02/24LC02B/24FC02
APPENDIX A: REVISION HISTORY
Revision L (05/2019)
Corrected Part Marking for UDFN package. Added
note about exposed pad on the TDFN and UDFN
packages.
Revision K (11/2018)
Added the 24FC02 device.
Revision J (02/2009)
Added TDFN Package; Updated Package Drawings.
Revision H (08/2008)
Added SC-70 Package; Updated Package Drawings.
Revision G (03/2007)
Replaced Package Drawings (Rev. AM).
Revision F (01/2007)
Revised Features section; Changed 1.8V to 1.7V in
Tables and text; Revised Ambient Temperature,
Section 1.0; Replaced Package Drawings; Revised
Product ID section.
Revision E
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure
7-2 Random Read; Figure 7-3 Sequential Read.
Revision D
Added DFN package.
Revision C
Corrections to Section 1.0, Electrical Characteristics.