Datasheet

ManualsBrandsMicrochip ManualsEEPROMEEPROM 2KB 900ns SOT-23

 2007-2019 Microchip Technology Inc. DS20001709L-page 1

24AA02/24LC02B/24FC02

Device Selection Table

Features

• Single Supply with Operation down to 1.7V for

24AA02 and 24FC02 Devices, 2.5V for 24LC02B

Devices

• Low-Power CMOS Technology:

- Read current 1 mA, maximum

- Standby current 1 μA, maximum (I-temp.)

• 2-Wire Serial Interface, I

C Compatible

• Schmitt Trigger Inputs for Noise Suppression

• Output Slope Control to Eliminate Ground Bounce

• 100 kHz, 400 kHz and 1 MHz Compatibility

• Page Write Time: 5 ms, Maximum

• Self-Timed Erase/Write Cycle

• 8-Byte Page Write Buffer

• Hardware Write-Protect

• ESD Protection >4,000V

• More than 1 Million Erase/Write Cycles

• Data Retention >200 Years

• Factory Programming Available

• RoHS Compliant

• Temperature Ranges:

- Industrial (I): -40°C to +85°C

- Extended (E): -40°C to +125°C

• Automotive AEC-Q100 Qualified

Packages

• 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP,

8-Lead SOIC, 8-Lead TDFN, 8-Lead TSSOP,

8-Lead UDFN, 5-Lead SOT-23 and 5-Lead SC-70

Description

The Microchip Technology Inc. 24XX02

(1)

is a 2-Kbit

Electrically Erasable PROM. The device is organized

as one block of 256 x 8-bit memory with a 2-wire serial

interface. Its low-voltage design permits operation

down to 1.7V with standby and active currents of only

1 μA and 1 mA, respectively. The 24XX02 also has a

page write capability for up to 8 bytes of data.

Package Types

Part Number VCC Range Max. Clock Frequency Temp. Ranges Available Packages

24AA02 1.7V-5.5V 400 kHz

(1)

I P, SN, MS, ST, MC, LT, MNY, OT

24LC02B 2.5V-5.5V 400 kHz I, E P, SN, MS, ST, MC, LT, MNY, OT

24FC02 1.7V-5.5V 1 MHz I, E P, SN, MS, ST, MUY, OT

Note 1: 100 kHz for V

CC < 2.5V

Note 1: 24XX02 is used in this document as a

generic part number for the

24AA02/24LC02B/24FC02 devices.

SOIC, TSSOP

SCL

SDA

DFN/TDFN/UDFN

VSS

SCL

SDA

SOT-23/SC-70

SCL

Vss

SDA

Vcc

Note 1: Pins A0, A1 and A2 are not used by the

24XX02 (no internal connections).

(Top View)

VCC

SCL

SDA

PDIP, MSOP

(Top View)

(1)

2K I

C Serial EEPROM

Summary of content (46 pages)

PAGE 1
24AA02/24LC02B/24FC02 2K I2C Serial EEPROM Device Selection Table Part Number VCC Range Max. Clock Frequency 400 kHz Temp. Ranges (1) I Available Packages P, SN, MS, ST, MC, LT, MNY, OT 24AA02 1.7V-5.5V 24LC02B 2.5V-5.5V 400 kHz I, E P, SN, MS, ST, MC, LT, MNY, OT 24FC02 1.7V-5.5V 1 MHz I, E P, SN, MS, ST, MUY, OT Note 1: 100 kHz for VCC < 2.5V Features Description • Single Supply with Operation down to 1.7V for 24AA02 and 24FC02 Devices, 2.
PAGE 2
4AA02/24LC02B/24FC02 Block Diagram WP I/O Control Logic Memory Control Logic HV Generator XDEC EEPROM Array Page Latches I/O SCL YDEC SDA VCC VSS  2007-2019 Microchip Technology Inc. Sense Amp.
PAGE 3
24AA02/24LC02B/24FC02 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V Storage temperature ....................................................................
PAGE 4
24AA02/24LC02B/24FC02 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS Param. Symbol No.
PAGE 5
24AA02/24LC02B/24FC02 TABLE 1-2: AC CHARACTERISTICS AC CHARACTERISTICS (Continued) Param. Symbol No. 14 TBUF 15 TOF Industrial (I): Extended (E): Extended (E): TA = -40°C to +85°C, VCC = +1.7V to +5.5V TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC02B) TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC02) Characteristic Min. Typ. Max. Units Bus Free Time: The time the bus must be free before a new transmission can start 1300 — — ns 2.5V ≤ VCC ≤ 5.5V 4700 — — ns 1.7V ≤ VCC < 2.
PAGE 6
24AA02/24LC02B/24FC02 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
PAGE 7
24AA02/24LC02B/24FC02 3.0 FUNCTIONAL DESCRIPTION The 24XX02 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while defining a device receiving data as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX02 works as slave.
PAGE 8
24AA02/24LC02B/24FC02 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device. The control byte consists of a four-bit control code. For the 24XX02, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are “don’t cares” for the 24XX02. The combination of the 4-bit control code and the next three bits are called the slave address.
PAGE 9
24AA02/24LC02B/24FC02 6.0 WRITE OPERATION 6.1 Byte Write 6.2 Following the Start condition from the master, the device code (4 bits), the block address (3 bits, “don’t cares”) and the R/W bit, which is a logic-low, is placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an Acknowledge bit during the ninth clock cycle.
PAGE 10
24AA02/24LC02B/24FC02 FIGURE 6-2: PAGE WRITE Bus Activity Master S T A R T SDA Line S 10 10 x x x0 Bus Activity x = “don’t care” Control Byte Block Select Bits  2007-2019 Microchip Technology Inc.
PAGE 11
24AA02/24LC02B/24FC02 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a write command (R/W = 0).
PAGE 12
24AA02/24LC02B/24FC02 8.0 READ OPERATION 8.3 Sequential Read Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read.
PAGE 13
24AA02/24LC02B/24FC02 FIGURE 8-2: RANDOM READ S T Control A Byte R T S 10 1 0 x x x 0 Bus Activity Master SDA Line Control Byte A C K Block Select Bits A C K x = “don’t care” FIGURE 8-3: Bus Activity Master SDA Line Bus Activity S T O P P Data (n) S1010 xxx 1 A Block C Select K Bits Bus Activity S T A R T Word Address (n) N o A C K SEQUENTIAL READ Control Byte Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + x) P 1 A C K  2007-2019 Microchip Technology Inc.
PAGE 14
24AA02/24LC02B/24FC02 9.0 PACKAGING INFORMATION 9.1 Package Marking Information* 8-Lead 2x3 DFN Example XXX YWW NN 224 922 13 8-Lead MSOP Example XXXXXX YWWNNN 4L2BI 92213F 8-Lead PDIP (300 mil) Example XXXXXXXX T/XXXNNN YYWW 24LC02B I/P e3 13F 1922 5-Lead SC-70 Example XXNN B413 8-Lead SOIC (3.90 mm) Example XXXXXXXX XXXXYYWW 24LC02BI SN e3 1922 NNN 13F  2007-2019 Microchip Technology Inc.
PAGE 15
24AA02/24LC02B/24FC02 5-Lead SOT-23 (1-Line Marking) Example XXNN M213 5-Lead SOT-23 (2-Line Marking) XXXXYY WWNNN 8-Lead 2x3 TDFN Example AAEV19 2213F Example XXX YWW NN A24 922 13 8-Lead TSSOP Example XXXX 4L02 TYWW I922 NNN 13F 8-Lead 2x3 UDFN XXX YWW NN  2007-2019 Microchip Technology Inc.
PAGE 16
24AA02/24LC02B/24FC02 Part Number 1st Line Marking Codes SOT-23 24AA02 24LC02B 24FC02 TSSOP MSOP UDFN 4A02 4A02T(1) 4L02 4L2BT(1) AADQ 24FC02 DFN TDFN SC-70 I-Temp. E-Temp. I-Temp. E-Temp. I-Temp. E-Temp. I-Temp. E-Temp.
PAGE 17
24AA02/24LC02B/24FC02 /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0& ± [ [ PP %RG\ >')1@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 2 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO +HLJKW $ 6WDQGRII $ &RQWDFW 7KLFNQH
PAGE 18
24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc.
PAGE 19
24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc.
PAGE 20
24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc.
PAGE 21
24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc.
PAGE 22
24AA02/24LC02B/24FC02 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2007-2019 Microchip Technology Inc.
PAGE 23
24AA02/24LC02B/24FC02 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 24
AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A e e 3 B 1 E1 E 2X 0.15 C 4 N 5X TIPS 0.30 C NOTE 1 2X 0.15 C 5X b 0.10 C A B TOP VIEW C c A2 A SEATING PLANE A1 L SIDE VIEW END VIEW Microchip Technology Drawing C04-061D Sheet 1 of 2  2007-2019 Microchip Technology Inc.
PAGE 25
24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 Molded Package Thickness A2 Overall Length D Exposed Pad Length D2 Overall Width E Exposed Pad Width E1 b Terminal Width Terminal Length L c Lead Thickness MIN 0.80 0.00 0.80 2.50 0.15 0.10 0.08 MILLIMETERS NOM 5 0.
PAGE 26
24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E Gx SILK SCREEN 3 2 1 C G 4 5 Y X RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width X Contact Pad Length Y Distance Between Pads G Distance Between Pads Gx MIN MILLIMETERS NOM 0.65 BSC 2.20 MAX 0.45 0.95 1.25 0.20 Notes: 1.
PAGE 27
24AA02/24LC02B/24FC02 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NX b 0.25 C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A–A 0.23 L (L1) VIEW C Microchip Technology Drawing No.
PAGE 28
24AA02/24LC02B/24FC02 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 29
24AA02/24LC02B/24FC02 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.
PAGE 30
24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A A2 0.20 C SEATING PLANE A SEE SHEET 2 C A1 SIDE VIEW Microchip Technology Drawing C04-028D [OT] Sheet 1 of  2007-2019 Microchip Technology Inc.
PAGE 31
24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c T L L1 VIEW A-A SHEET 1 Units Dimension Limits Number of Pins N e Pitch e1 Outside lead pitch Overall Height A Molded Package Thickness A2 Standoff A1 E Overall Width E1 Molded Package Width D Overall Length L Foot Length Footprint L1 I Foot Angle c Lead Thickness b Lead Width MIN 0.
PAGE 32
24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch C Contact Pad Spacing X Contact Pad Width (X5) Contact Pad Length (X5) Y Distance Between Pads G Distance Between Pads GX Overall Width Z MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.
PAGE 33
24AA02/24LC02B/24FC02 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C C (A3) A SEATING PLANE 8X 0.08 C A1 SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 0.
PAGE 34
24AA02/24LC02B/24FC02 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 35
24AA02/24LC02B/24FC02 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 36
24AA02/24LC02B/24FC02 /HDG 3ODVWLF 7KLQ 6KULQN 6PDOO 2XWOLQH 67 ± PP %RG\ >76623@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO +HLJKW $ ± %6& ± 0ROGHG 3DFNDJH 7KLFNQHVV $ 6WDQGRII $ ± 2YHUDOO :LGWK ( 0ROGHG 3D
PAGE 37
24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc.
PAGE 38
24AA02/24LC02B/24FC02 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) E (DATUM B) NOTE 1 2X 0.10 C 1 2 2X 0.10 C TOP VIEW A1 0.10 C C SEATING PLANE A 8X (A3) SIDE VIEW 0.10 0.08 C C A B D2 e 2 1 2 0.10 E2 C A B K N L 8X b e 0.10 0.
PAGE 39
24AA02/24LC02B/24FC02 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 40
24AA02/24LC02B/24FC02 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
PAGE 41
24AA02/24LC02B/24FC02 APPENDIX A: REVISION HISTORY Revision L (05/2019) Corrected Part Marking for UDFN package. Added note about exposed pad on the TDFN and UDFN packages. Revision K (11/2018) Added the 24FC02 device. Revision J (02/2009) Added TDFN Package; Updated Package Drawings. Revision H (08/2008) Added SC-70 Package; Updated Package Drawings. Revision G (03/2007) Replaced Package Drawings (Rev. AM). Revision F (01/2007) Revised Features section; Changed 1.8V to 1.
PAGE 42
24AA02/24LC02B/24FC02 NOTES:  2007-2019 Microchip Technology Inc.
PAGE 43
24AA02/24LC02B/24FC02 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers.
PAGE 44
24AA02/24LC02B/24FC02 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X] PART NO. Device Device: (1) Tape and Reel Option –X /XX Temperature Range Package 24AA02: = 1.7V, 2-Kbit I2C Serial EEPROM 24LC02B: = 2.5V, 2-Kbit I2C Serial EEPROM 24FC02: = 1.
PAGE 45
24AA02/24LC02B/24FC02 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 46
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