Datasheet

 2008-2018 Microchip Technology Inc. DS20002124H-page 25
24AA02E48/24AA025E48/24AA02E64/24AA025E64
Microchip Technology Drawing C04-028C (OT) Sheet 2 of 2
6-Lead Plastic Small Outline Transistor (OT, OTY) [SOT-23]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
protrusions shall not exceed 0.25mm per side.
1.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2.
Notes:
REF: Reference Dimension, usually without tolerance, for information purposes only.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Dimensioning and tolerancing per ASME Y14.5M
Foot Angle
Number of Leads
Pitch
Outside lead pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Lead Width
L1
φ
b
c
Dimension Limits
E
E1
D
L
e1
A
A2
A1
Units
N
e
0°
0.08
0.20 -
-
-
10°
0.26
0.51
MILLIMETERS
0.95 BSC
1.90 BSC
0.30
0.90
0.89
0.00
0.60 REF
2.90 BSC
0.45
2.80 BSC
1.60 BSC
1.15
-
-
MIN
6
NOM
1.45
1.30
0.15
0.60
MAX
Seating Plane to Gauge Plane L1 0.25 BSC