Datasheet

 2009-2019 Microchip Technology Inc. DS20001711L-page 25
24AA01/24LC01B/24FC01
Microchip Technology Drawing C04-061D Sheet 2 of 2
Number of Pins
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Molded Package Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E1
A2
e
L
E
N
0.65 BSC
0.10
0.15
0.80
0.00
-
0.20
1.25 BSC
-
-
2.10 BSC
MILLIMETERS
MIN
NOM
5
0.46
0.40
1.10
0.10
MAX
c
-0.08 0.26
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Lead Thickness
5-Lead Plastic Small Outline Transistor (LT) [SC70]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Exposed Pad Length
D
D2
2.50
2.00 BSC
2.60 2.70
0.80 - 1.00
1.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M