24AA01/24LC01B/24FC01 1K I2C Serial EEPROM Device Selection Table Part Number VCC Range Max. Clock Frequency 400 Temp. Ranges kHz(1) Available Packages 24AA01 1.7V-5.5V I P, SN, MS, ST, MC, LT, MNY, OT 24LC01B 2.5V-5.5V 400 kHz I, E P, SN, MS, ST, MC, LT, MNY, OT 24FC01 1.7V-5.5V 1 MHz I, E P, SN, MS, ST, MUY, OT Note 1: 100 kHz for VCC < 2.5V Features Description • Single Supply with Operation down to 1.7V for 24AA01 and 24FC01 Devices, 2.
4AA01/24LC01B/24FC01 Block Diagram WP I/O Control Logic Memory Control Logic HV Generator XDEC EEPROM Array Page Latches I/O SCL YDEC SDA VCC VSS 2009-2019 Microchip Technology Inc. Sense Amp.
24AA01/24LC01B/24FC01 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ..........................................................................................................-0.3V to VCC +1.0V Storage temperature ....................................................................
24AA01/24LC01B/24FC01 TABLE 1-2 AC CHARACTERISTICS AC CHARACTERISTICS Param. Symbol No.
24AA01/24LC01B/24FC01 TABLE 1-2 AC CHARACTERISTICS (CONTINUED) AC CHARACTERISTICS (Continued) Param. Symbol No. 14 TBUF 15 Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC01B) Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC01) Characteristic Min. Typ. Bus Free Time: The time the bus must be free before a new transmission can start 1300 — — ns 2.5V ≤ VCC ≤ 5.5V 4700 — — ns 1.7V ≤ VCC < 2.
24AA01/24LC01B/24FC01 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1.
24AA01/24LC01B/24FC01 3.0 FUNCTIONAL DESCRIPTION The 24XX01 supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while defining a device receiving data as a receiver. The bus has to be controlled by a master device which generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24XX01 works as slave.
24AA01/24LC01B/24FC01 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the master device. The control byte consists of a four-bit control code. For the 24XX01, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are “don’t cares” for the 24XX01. The combination of the 4-bit control code and the next three bits are called the slave address.
24AA01/24LC01B/24FC01 6.0 WRITE OPERATION 6.1 Byte Write 6.2 Following the Start condition from the master, the device code (4 bits), the block address (3 bits, “don’t cares”) and the R/W bit, which is a logic-low, is placed onto the bus by the master transmitter. This indicates to the addressed slave receiver that a byte with a word address will follow after it has generated an Acknowledge bit during the ninth clock cycle.
24AA01/24LC01B/24FC01 FIGURE 6-2: PAGE WRITE Bus Activity Master S T A R T SDA Line S 10 10 x x x0 Bus Activity x = “don’t care” Control Byte Block Select Bits 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a write command (R/W = 0).
24AA01/24LC01B/24FC01 8.0 READ OPERATION 8.3 Sequential Read Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the slave address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read.
24AA01/24LC01B/24FC01 FIGURE 8-2: RANDOM READ S T Control A Byte R T S 10 1 0 x x x 0 Bus Activity Master SDA Line Control Byte A C K Block Select Bits A C K x = “don’t care” FIGURE 8-3: Bus Activity Master SDA Line Bus Activity S T O P P Data (n) S1010 xxx 1 A Block C Select K Bits Bus Activity S T A R T Word Address (n) N o A C K SEQUENTIAL READ Control Byte Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + x) P 1 A C K 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 9.0 PACKAGING INFORMATION 9.1 Package Marking Information* 8-Lead 2x3 DFN Example XXX YWW NN 214 922 13 8-Lead MSOP Example XXXXXX YWWNNN 4L1BI 92213F 8-Lead PDIP (300 mil) Example XXXXXXXX T/XXXNNN YYWW 24LC01B I/P e3 13F 1922 5-Lead SC-70 Example XXNN B13F 8-Lead SOIC (3.90 mm) Example XXXXXXXX XXXXYYWW 24LC01BI SN e3 1922 NNN 13F 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 5-Lead SOT-23 (1-Line Marking) Example XXNN 2K3F 5-Lead SOT-23 (2-Line Marking) Example XXXXYY WWNNN AAEU19 2213F 8-Lead 2x3 TDFN Example A14 922 13 XXX YWW NN Example 8-Lead TSSOP XXXX 4L1B TYWW I922 NNN 13F 8-Lead 2x3 UDFN Example ADM 922 13 Part Number XXX YWW NN 24AA01 1st Line Marking Codes SOT-23 TSSOP MSOP (1) UDFN I-Temp E-Temp — B1NN(2,3) — M1NN(2,3) N1NN(2,3) 4A01 4A01T 24LC01B 4L1B 4L1BT(1) — 24FC01 AADP 24FC01 ADM Note 1: 2: 3: 4:
24AA01/24LC01B/24FC01 Legend: XX...X T Y YY WW NNN e3 Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) JEDEC® designator for Matte Tin (Sn) * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
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24AA01/24LC01B/24FC01 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
AA01/24LC01B/24FC01 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A e e 3 B 1 E1 E 2X 0.15 C N 4 5X TIPS 0.30 C NOTE 1 2X 0.15 C 5X b 0.10 C A B TOP VIEW C c A2 A SEATING PLANE A1 L SIDE VIEW END VIEW Microchip Technology Drawing C04-061D Sheet 1 of 2 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 Molded Package Thickness A2 Overall Length D Exposed Pad Length D2 Overall Width E Exposed Pad Width E1 b Terminal Width Terminal Length L c Lead Thickness MIN 0.80 0.00 0.80 2.50 0.15 0.10 0.08 MILLIMETERS NOM 5 0.
24AA01/24LC01B/24FC01 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E Gx SILK SCREEN 3 2 1 C G 4 5 Y X RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width X Contact Pad Length Y Distance Between Pads G Distance Between Pads Gx MIN MILLIMETERS NOM 0.65 BSC 2.20 MAX 0.45 0.95 1.25 0.20 Notes: 1.
24AA01/24LC01B/24FC01 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NX b 0.25 C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A–A 0.23 L (L1) VIEW C Microchip Technology Drawing No.
24AA01/24LC01B/24FC01 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
24AA01/24LC01B/24FC01 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.
24AA01/24LC01B/24FC01 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A A2 0.20 C SEATING PLANE A SEE SHEET 2 C A1 SIDE VIEW Microchip Technology Drawing C04-028D [OT] Sheet 1 of 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c T L L1 VIEW A-A SHEET 1 Units Dimension Limits Number of Pins N e Pitch e1 Outside lead pitch Overall Height A Molded Package Thickness A2 Standoff A1 E Overall Width E1 Molded Package Width D Overall Length L Foot Length Footprint L1 I Foot Angle c Lead Thickness b Lead Width MIN 0.
24AA01/24LC01B/24FC01 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch C Contact Pad Spacing X Contact Pad Width (X5) Contact Pad Length (X5) Y Distance Between Pads G Distance Between Pads GX Overall Width Z MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.
24AA01/24LC01B/24FC01 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C C (A3) A SEATING PLANE 8X 0.08 C A1 SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 0.
24AA01/24LC01B/24FC01 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
24AA01/24LC01B/24FC01 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
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24AA01/24LC01B/24FC01 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2009-2019 Microchip Technology Inc.
24AA01/24LC01B/24FC01 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) E (DATUM B) NOTE 1 2X 0.10 C 1 2 2X 0.10 C TOP VIEW A1 0.10 C C SEATING PLANE A 8X (A3) SIDE VIEW 0.10 0.08 C C A B D2 e 2 1 2 0.10 E2 C A B K N L 8X b e 0.10 0.
24AA01/24LC01B/24FC01 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
24AA01/24LC01B/24FC01 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.
24AA01/24LC01B/24FC01 APPENDIX A: REVISION HISTORY Revision L (05/2019) Corrected Part Marking for UDFN package. Added note about exposed pad on the TDFN and UDFN packages. Revision K (11/2018) Added the 24FC01 device. Revision J (01/2009) Added TDFN Package; Updated Package Drawings. Revision H (08/2008) Added SC-70 Package; Updated Package Drawings. Revision G (03/2007) Replaced Package Drawings (Rev. AM). Revision F (01/2007) Revised Device Selection Table; Revised Features Section; Changed 1.
24AA01/24LC01B/24FC01 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers.
24AA01/24LC01B/24FC01 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) –X /XX Device Tape and Reel Option Temperature Range Package Device: 24AA01: = 1.7V, 1 Kbit I2C Serial EEPROM 24LC01B: = 2.5V, 1 Kbit I2C Serial EEPROM 24FC01: = 1.
24AA01/24LC01B/24FC01 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
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