User Manual
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Ordering Information and Module Marking
- 2. Block Diagram
- 3. Pinout and Package Information
- 4. Electrical Characteristics
- 5. Power Management
- 6. Clocking
- 7. CPU and Memory Subsystem
- 8. WLAN Subsystem
- 9. Bluetooth Low Energy 4.0
- 10. External Interfaces
- 11. Application Reference Design
- 12. Module Outline Drawings
- 13. Design Consideration
- 14. Reflow Profile Information
- 15. Module Assembly Considerations
- 16. Regulatory Approval
- 17. Reference Documentation
- 18. Document Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
3. Pinout and Package Information
This package contains an exposed paddle that must be connected to the system board ground. The
ATWINC3400-MR210CA module pin assignment is shown in following figure.
Figure 3-1. ATWINC3400-MR210CA Module Pin Assignment
ATWINC3400-MR210CA
MODULE
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
J11
J12
J13
J14
J15
J16
J17
J18
J19
J20
J21
J22
J23
J24
J25
J26
J27
J28
J29
J30
J31
J32
J33
J34
J35
J36
GND
I2C_SDA_M
I2C_SCL_M
IRQN
GPIO20
GPIO19
GPIO18
GPIO17
GND
GPIO7
SPI_MOSI
SPI_SSN
SPI_MISO
SPI_SCK
GPIO8
GND
RTC_CLK
CHIP_EN
VBAT
UART_RXD
UART_TXD
GPIO4
GPIO3
GND
VDDIO
BT_RXD
BT_TXD
RESETN
N/C
N/C
N/C
N/C
SPI_CFG
GND
I2C_SDA_S
I2C_SCL_S
The following table provides the ATWINC3400-MR210CA module pin description.
ATWINC3400-MR210CA
© 2017 Microchip Technology Inc.
Draft Datasheet Preliminary
DS00000000A-page 7