User Manual
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Ordering Information and Module Marking
- 2. Block Diagram
- 3. Pinout and Package Information
- 4. Electrical Characteristics
- 5. Power Management
- 6. Clocking
- 7. CPU and Memory Subsystem
- 8. WLAN Subsystem
- 9. Bluetooth Low Energy 4.0
- 10. External Interfaces
- 11. Application Reference Design
- 12. Module Outline Drawings
- 13. Design Consideration
- 14. Reflow Profile Information
- 15. Module Assembly Considerations
- 16. Regulatory Approval
- 17. Reference Documentation
- 18. Document Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
Figure 14-1. Solder Reflow Profile
Cleaning
The exposed ground paddle helps to self-align the module, avoiding pad misalignment. The use of no
clean solder pastes is recommended. As a result of reflow process, ensure to completely dry the no-clean
paste fluxes. This may require longer reflow profiles and/or peak temperatures toward the high end of the
process window as recommended by the solder paste vendor. It is believed that uncured flux residues
can lead to corrosion and/or shorting in accelerated testing and possibly the field.
Rework
The rework removes the mounted SIP package and replaces it with a new unit. It is recommended that
once an ATWINC3400-MR210CA module is removed and it must never be reused. During the rework
process, the mounted module and PCB are heated partially, and the module is removed. It is
recommended to heat-proof the proximity of the mounted parts and junctions and use the best nozzle for
rework that is suited to the module size.
ATWINC3400-MR210CA
© 2017 Microchip Technology Inc.
Draft Datasheet Preliminary
DS00000000A-page 43