User Manual
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Ordering Information and Module Marking
- 2. Block Diagram
- 3. Pinout and Package Information
- 4. Electrical Characteristics
- 5. Power Management
- 6. Clocking
- 7. CPU and Memory Subsystem
- 8. WLAN Subsystem
- 9. Bluetooth Low Energy 4.0
- 10. External Interfaces
- 11. Application Reference Design
- 12. Module Outline Drawings
- 13. Design Consideration
- 14. Reflow Profile Information
- 15. Module Assembly Considerations
- 16. Regulatory Approval
- 17. Reference Documentation
- 18. Document Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
11.1. Host Interface - SPI.................................................................................................................... 35
12. Module Outline Drawings........................................................................................ 37
13. Design Consideration.............................................................................................. 38
13.1. Module Placement and Routing Guidelines............................................................................... 38
13.2. Antenna Performance................................................................................................................ 39
14. Reflow Profile Information....................................................................................... 41
14.1. Storage Condition.......................................................................................................................41
14.2. Solder Paste...............................................................................................................................41
14.3. Stencil Design............................................................................................................................ 41
14.4. Baking Conditions...................................................................................................................... 41
14.5. Soldering and Reflow Condition................................................................................................. 41
15. Module Assembly Considerations........................................................................... 44
16. Regulatory Approval................................................................................................45
16.1. United States..............................................................................................................................45
16.2. Canada.......................................................................................................................................46
16.3. Europe........................................................................................................................................48
16.4. Other Regulatory Information..................................................................................................... 49
17. Reference Documentation.......................................................................................50
18. Document Revision History..................................................................................... 51
The Microchip Web Site................................................................................................ 52
Customer Change Notification Service..........................................................................52
Customer Support......................................................................................................... 52
Product Identification System........................................................................................53
Microchip Devices Code Protection Feature................................................................. 53
Legal Notice...................................................................................................................53
Trademarks................................................................................................................... 53
Quality Management System Certified by DNV.............................................................54
Worldwide Sales and Service........................................................................................55
ATWINC3400-MR210CA
© 2017 Microchip Technology Inc.
Draft Datasheet Preliminary
DS00000000A-page 4