User Manual

Table Of Contents
Place GND polygon pour below the module on the top layer of the host board. Avoid
breaks in this GND plane, ensure continuous GND plane for better RF performance.
GND polygon pour in the top layer of the host board should have a minimum area of 20
x 40 mm.
Place sufficient GND vias on host board edge and below the module for better RF
performance.
It is recommended to have a 5x5 grid of GND vias solidly connecting the exposed GND
paddle of the module to the ground plane of the host board. This will act as a good
ground and thermal conduction path for the ATWINC3400-MR210CA module. The GND
vias should have a minimum via hole size of 0.2 mm.
Antenna on the module should not be placed in direct contact or close proximity to
plastic casing/objects. Keep a minimum clearance of >7 mm in all directions around the
chip antenna.
Figure 13-2. ATWINC3400-MR210CA Placement Reference
13.2 Antenna Performance
The ATWINC3400-MR210CA uses a chip antenna which is fed via matching network. The table below
lists the technical specification of the chip antenna.
Table 13-1. Chip antenna specification
Paramater Value
Peak gain 0.5 dBi
Operating frequency 2400 - 2500 MHz
ATWINC3400-MR210CA
© 2017 Microchip Technology Inc.
Draft Datasheet Preliminary
DS00000000A-page 39