User Manual
Table Of Contents
- Introduction
- Features
- Table of Contents
- 1. Ordering Information and Module Marking
- 2. Block Diagram
- 3. Pinout and Package Information
- 4. Electrical Characteristics
- 5. Power Management
- 6. Clocking
- 7. CPU and Memory Subsystem
- 8. WLAN Subsystem
- 9. Bluetooth Low Energy 4.0
- 10. External Interfaces
- 11. Application Reference Design
- 12. Module Outline Drawings
- 13. Design Consideration
- 14. Reflow Profile Information
- 15. Module Assembly Considerations
- 16. Regulatory Approval
- 17. Reference Documentation
- 18. Document Revision History
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Product Identification System
- Microchip Devices Code Protection Feature
- Legal Notice
- Trademarks
- Quality Management System Certified by DNV
- Worldwide Sales and Service
13. Design Consideration
This section provides the guidelines on module placement and routing to achieve the best performance.
13.1 Module Placement and Routing Guidelines
It is critical to follow the recommendations listed below to achieve the best RF performance:
• The module must be placed on the host board and the chip antenna area must not overlap with the
host board. The following figure on placement reference shows the best, poor, and worst case
module placements in the host board.
Figure 13-1. ATWINC3400-MR210CA Placement Example
Caution: Do not place the module in the middle of the host board or far away from the
host board edge.
• Follow the host board mechanical recommendation, ground plane and keep out recommendations
as shown in the following figure. Module chip antenna is specifically tuned for this host board
mechanical recommendation as shown in the following figure. The host PCB should have a
thickness of 1.5 mm
– Follow the module placement and keep out recommendation as shown in the following figure
• Avoid routing any traces on the top layer of the host board which will be directly below
the module area.
• In keep out region, there should be no copper traces in all signal layers.
• Avoid placing any components (like mechanical spacers, bumpon and so on) on the
host board closer to the chip antenna region.
ATWINC3400-MR210CA
© 2017 Microchip Technology Inc.
Draft Datasheet Preliminary
DS00000000A-page 38