User Manual

Table of Contents
Introduction......................................................................................................................1
Features.......................................................................................................................... 1
1. Ordering Information and Module Marking................................................................ 5
2. Block Diagram........................................................................................................... 6
3. Pinout and Package Information............................................................................... 7
3.1. Package Description.................................................................................................................. 10
4. Electrical Characteristics..........................................................................................11
4.1. Absolute Maximum Ratings........................................................................................................11
4.2. Recommended Operating Conditions........................................................................................ 11
4.3. DC Characteristics..................................................................................................................... 12
4.4. IEEE 802.11 b/g/n Radio Performance...................................................................................... 12
4.5. Bluetooth Radio Performance.................................................................................................... 14
4.6. Timing Characteristics................................................................................................................ 16
5. Power Management................................................................................................ 21
5.1. Device States............................................................................................................................. 21
5.2. Controlling Device States........................................................................................................... 21
5.3. Power-Up/Down Sequence........................................................................................................ 22
5.4. Digital I/O Pin Behavior During Power-Up Sequences...............................................................23
6. Clocking...................................................................................................................24
6.1. Low-Power Clock....................................................................................................................... 24
7. CPU and Memory Subsystem................................................................................. 25
7.1. Processor................................................................................................................................... 25
7.2. Memory Subsystem....................................................................................................................25
7.3. Nonvolatile Memory....................................................................................................................25
8. WLAN Subsystem................................................................................................... 27
8.1. MAC........................................................................................................................................... 27
8.2. PHY............................................................................................................................................28
8.3. Radio..........................................................................................................................................28
9. Bluetooth Low Energy 4.0....................................................................................... 30
10. External Interfaces...................................................................................................31
10.1. Interfacing with the Host Microcontroller.................................................................................... 31
10.2. SPI Interface...............................................................................................................................32
10.3. UART Interface...........................................................................................................................34
11. Application Reference Design................................................................................. 35
© 2017 Microchip Technology Inc.
Draft Datasheet Preliminary
DS00000000A-page 3