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ATWINC3400-MR210CA

IEEE 802.11 b/g/n Network Controller Module with

Integrated Bluetooth Low Energy 4.0

Introduction

The ATWINC3400-MR210CA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC)

network controller module with Bluetooth Low Energy technology that is compliant with Bluetooth version

4.0. This module is optimized for low power and high performance mobile applications. This module

features small form factor when integrating Power Amplifier (PA), Low-Noise Amplifier (LNA), Transmit/

Receive (T/R) switch (for Wi-Fi and Bluetooth), Power Management Unit (PMU), and Chip Antenna. The

ATWINC3400-MR210CA module requires a 32.768 kHz clock for Sleep operation.

The ATWINC3400-MR210CA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence

protocols, and provides Serial Peripheral Interface (SPI) to interface with the host controller.

Features

Wi-Fi features:

• IEEE 802.11 b/g/n RF/PHY/MAC

• IEEE 802.11 b/g/n (1x1) with single spatial stream, up to 72 Mbps PHY rate in 2.4 GHz ISM band

• Integrated chip antenna

• Superior sensitivity and range via advanced PHY signal processing

• Advanced equalization and channel estimation

• Advanced carrier and timing synchronization

• Supports Soft-AP

• Supports IEEE 802.11 WEP, WPA, and WPA2

• Superior MAC throughput through hardware accelerated two-level A-MSDU/A-MPDU frame

aggregation and block acknowledgment

• On-chip memory management engine to reduce the host load

• Operating temperature range from -40°C to +85°C

• Wi-Fi Alliance

certified for connectivity and optimizations

– ID: WFA62065

• Integrated on-chip microcontroller

• SPI host interface

• Integrated Flash memory for Wi-Fi and Bluetooth system software

• Low leakage on-chip memory for state variables

• Fast AP re-association (150 ms)

• On-chip network stack to offload MCU

– Integrated network IP slack to minimize the host CPU requirements

• Network features: Firmware version 1:2:x

Draft Datasheet Preliminary

DS00000000A-page 1

Summary of content (55 pages)

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ATWINC3400-MR210CA IEEE 802.11 b/g/n Network Controller Module with Integrated Bluetooth Low Energy 4.0 Introduction The ATWINC3400-MR210CA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network controller module with Bluetooth Low Energy technology that is compliant with Bluetooth version 4.0. This module is optimized for low power and high performance mobile applications.
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ATWINC3400-MR210CA – TCP, UDP, DHCP, ARP, HTTP, SSL, DNS, and SNTP Bluetooth features: • • • • Bluetooth 4.0 (Bluetooth Low Energy) certifications – Controller QD ID - 77870 – Host QD ID - 77451 Class 2 transmission Adaptive Frequency Hopping (AFH) Superior sensitivity and range © 2017 Microchip Technology Inc.
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Table of Contents Introduction......................................................................................................................1 Features.......................................................................................................................... 1 1. Ordering Information and Module Marking................................................................ 5 2. Block Diagram........................................................................................................
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ATWINC3400-MR210CA 11.1. Host Interface - SPI.................................................................................................................... 35 12. Module Outline Drawings........................................................................................ 37 13. Design Consideration.............................................................................................. 38 13.1. Module Placement and Routing Guidelines............................................................
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ATWINC3400-MR210CA 1. Ordering Information and Module Marking The following table provides the ordering details for the ATWINC3400-MR210CA module. Table 1-1. Ordering Details Model Number ATWINC3400MR210CA Ordering Code Package Regulatory Information Description ATWINC3400-MR210CAxxx 22.43 x 1 14.73 x 2.0 mm FCC, IC, CE 2 Certified module with chip antenna Note: 1. 'xxx' in the preceding table and following figure denotes the software version. Order code changes as per the software version.
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ATWINC3400-MR210CA 2. Block Diagram The following figure shows the block diagram of the ATWINC3400-MR210CA module. Figure 2-1. ATWINC3400-MR210CA Module Block Diagram ATWINC3400 IC © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA Pinout and Package Information This package contains an exposed paddle that must be connected to the system board ground. The ATWINC3400-MR210CA module pin assignment is shown in following figure. Figure 3-1.
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ATWINC3400-MR210CA Table 3-1. ATWINC3400-MR210CA Module Pin Description Pin # Pin Name Pin Type Description 1 GND GND Ground pin. 2 SPI_CFG Digital Input Serial Peripheral Interface pin, which must be died to VDDIO. 3 NC - No connection. 4 NC - No connection. 5 NC - No connection. 6 NC - No connection. 7 RESETN Digital Input • • • Active-low hard Reset pin. When the Reset pin is asserted low, the module is in the Reset state.
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ATWINC3400-MR210CA Pin # Pin Name Pin Type Description 16 UART_TXD Digital I/O, Programmable pull up • • Wi-Fi UART TxD output pin. Used only for debug development purposes. It is recommended to add a test point for this pin. 17 UART_RXD Digital I/O, Programmable pull up • • Wi-Fi UART RxD input pin. Used only for debug development purposes. It is recommended to add a test point for this pin. 18 VBAT Power 19 CHIP_EN Digital Input Power supply pin for DC/DC converter and PA.
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ATWINC3400-MR210CA Pin # Pin Name Pin Type Description 31 GPIO19 Digital I/O, Programmable pull up General Purpose Input/Output pin. 32 GPIO20 Digital I/O, Programmable pull up General Purpose Input/Output pin. 33 IRQN Digital output, Programmable pull up • • 3.1 ATWINC3400-MR210CA module host interrupt request output pin. This pin must connect to a host interrupt pin. 34 I2C_SCL_M Digital I/O, Programmable pull up I2C Master clock pin.
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ATWINC3400-MR210CA 4. Electrical Characteristics This chapter provides an overview of the electrical characteristics of the ATWINC3400-MR210CA module. 4.1 Absolute Maximum Ratings The following table provides the absolute maximum ratings for the ATWINC3400-MR210CA module. Table 4-1. ATWINC3400-MR210CA Module Absolute Maximum Ratings Symbol Parameter Min. Max. Unit V VDDIO I/O supply voltage -0.3 5.0 VBAT Battery supply voltage -0.3 5.0 VIN Digital input voltage -0.
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ATWINC3400-MR210CA Table 4-2. ATWINC3400-MR210CA Module Recommended Operating Conditions Symbol Parameter Min. Typ. Max. Units VDDIO I/O supply voltage (1) 2.7 3.3 3.6 V VBAT Battery supply voltage(2)(3) 3.0 3.6 4.2 V - Operating temperature -40 - 85 ºC Note: 1. I/O supply voltage is applied to the VDDIO pin. 2. Battery supply voltage is applied to the VBAT pin. 3.
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ATWINC3400-MR210CA Table 4-4. IEEE 802.11 Receiver Performance Characteristics Parameter Description Min. Typ. Max. Unit 2,412 - 2,472 MHz dBm Frequency - Sensitivity 802.11b 1 Mbps DSSS - -95.0 - 2 Mbps DSSS - -93.5 - 5.5 Mbps DSSS - -90.0 - 11 Mbps DSSS - -86.0 - 6 Mbps OFDM - -90.0 - 9 Mbps OFDM - -88.5 - 12 Mbps OFDM - -86.0 - 18 Mbps OFDM - -84.5 - 24 Mbps OFDM - -82.0 - 36 Mbps OFDM - -78.5 - 48 Mbps OFDM - -74.5 - 54 Mbps OFDM - -73.
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ATWINC3400-MR210CA 4.4.2 Transmitter Performance The transmitter performance is tested under following conditions: • VBAT = 3.3V • VDDIO = 3.3V • Temp = 25°C The following table provides the transmitter performance characteristics for the ATWINC3400-MR210CA module. Table 4-5. IEEE 802.11 Transmitter Performance Characteristics Parameter Description Minimum Typical Max. Unit 2,412 - 2,472 MHz dBm Frequency - Output power 802.11b 1 Mbps - 16.7(1) - 802.11b 11 Mbps - 17.5(1) - 802.
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ATWINC3400-MR210CA • • • VDDIO = 3.3V Temp: 25°C Measured after RF matching network. The following table provides the Bluetooth receiver performance characteristics for the ATWINC3400MR210CA module. Table 4-6. Bluetooth Receiver Performance Characteristics Parameter 4.5.2 Description Min. Typ. Max. Unit 2,402 - 2,480 MHz dBm Frequency - Sensitivity (ideal Tx) Bluetooth Low Energy (GFSK) - -92.5 - Maximum receive signal level Bluetooth Low Energy (GFSK) - -3.
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ATWINC3400-MR210CA Parameter Description In-band spurious emission (Bluetooth Low Energy) N+2 (Image frequency) - -33 - N + 3 (Adjacent to image frequency) - -32 - N-2 - -50 - N-3 - -49 - 4.6 Timing Characteristics 4.6.1 I2C Slave Timing Min. Typ. Max. Unit The I2C Slave timing diagram for the ATWINC3400-MR210CA module is shown in the following figure. Figure 4-1.
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ATWINC3400-MR210CA Parameter 4.6.2 Symbol Min. Max. Units 40 - µs STOP Setup Time tSUSTO 0.6 - Bus Free Time Between STOP and START tBUF 1.3 - Glitch Pulse Reject tPR 0 50 Remarks Master Programming Option - µs ns - SPI Slave Timing The SPI Slave timing for the ATWINC3400-MR210CA module is provided in the following figures. Figure 4-2. SPI Slave Clock Polarity and Clock Phase Timing © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA Figure 4-3. SPI Slave Timing Diagram The following table provides the SPI Slave timing parameters for the ATWINC3400-MR210CA module. Table 4-9. SPI Slave Timing Parameters (1) Parameter Symbol Min. Max.
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ATWINC3400-MR210CA Parameter Symbol Min. Max. SSN Input Setup Time tSUSSN 5 - SSN Input Hold Time tHDSSN 5 - Unit Note: 1. Timing is applicable to all SPI modes. 2. Maximum clock frequency specified is limited by the SPI Slave interface internal design; actual maximum clock frequency can be lower and depends on the specific PCB layout. 3. Timing based on 15 pF output loading. 4.6.3 SPI Master Timing The SPI Master timing for the ATWINC3400-MR210CA module is shown in the following figure.
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ATWINC3400-MR210CA 1. 2. 3. Timing is applicable to all SPI modes. Maximum clock frequency specified is limited by the SPI Master interface internal design; actual maximum clock frequency can be lower and depends on the specific PCB layout. Timing based on 15 pF output loading. © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA 5. Power Management 5.1 Device States The ATWINC3400-MR210CA module has multiple device states, based on the state of the IEEE 802.11 and Bluetooth subsystems. It is possible for both subsystems to be active at the same time. To simplify the device power consumption breakdown, the following basic states are defined. One subsystem can be active at a time: • • • • • • 5.2 WiFi_ON_Transmit – Device actively transmits IEEE 802.
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ATWINC3400-MR210CA Device State Code Rate Output Power (dBm) Current Consumption(1) IVBAT IVDDIO 802.11n MCS 7 N/A 63.9 mA 23.7 mA ON_BT_Transmit (@3.2 dBm Pout) BLE 4.0 1 Mbps 1.5 79.37 mA 23.68 mA ON_BT_Receive BLE 4.0 1 Mbps N/A 51.36 mA 23.68 mA Doze (Bluetooth Low Energy Idle) N/A N/A 53 mA (2) Doze (Bluetooth Low Energy Low Power) N/A N/A 1 mA (2) Power_Down N/A N/A 10.5 uA(2) Note: 1. Conditions: VBAT = 3.3V, VDDIO = 3.3V, at 25°C. 2.
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ATWINC3400-MR210CA Table 5-2. Power-Up/Down Sequence Timing Paramet Min. er 5.4 Max. Unit s Description Notes tA 0 - ms VBAT rise to VDDIO rise VBAT and VDDIO can rise simultaneously or connected together. VDDIO must not rise before VBAT. tB 0 - ms VDDIO rise to CHIP_EN rise CHIP_EN must not rise before VDDIO. CHIP_EN must be driven high or low and must not be left floating. tC 5 - ms CHIP_EN rise to RESETN rise This delay is required to stabilize the XO clock before RESETN removal.
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ATWINC3400-MR210CA 6. Clocking 6.1 Low-Power Clock The ATWINC3400-MR210CA module requires an external 32.768 kHz clock to be supplied at the module pin 20. This clock is used during the sleep operation. The frequency accuracy of this external clock must be within ±200 ppm. © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA 7. CPU and Memory Subsystem 7.1 Processor The ATWINC3400-MR210CA module has two Cortus APS3 32-bit processors, one is used for Wi-Fi and the other is used for Bluetooth. In IEEE 802.11 mode, the processor performs many of the MAC functions, including but not limited to: association, authentication, power management, security key management, and MSDU aggregation/de-aggregation.
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ATWINC3400-MR210CA 8. WLAN Subsystem The WLAN subsystem is composed of the Media Access Controller (MAC), Physical Layer (PHY), and the radio. 8.1 MAC The ATWINC3400-MR210CA module is designed to operate at low power, while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control logic, and a low power, high-efficiency microprocessor.
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ATWINC3400-MR210CA • • • 8.2 – WEP 64/128 – WPA-TKIP – 128-bit WPA2 CCMP (AES) Advanced power management: – Standard IEEE 802.11 power save mode RTS-CTS and CTS-self support Either STA or AP mode in the infrastructure basic service set mode PHY The ATWINC3400-MR210CA module WLAN PHY is designed to achieve reliable and power-efficient physical layer communication specified by IEEE 802.11 b/g/n in single stream mode with 20 MHz bandwidth.
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ATWINC3400-MR210CA Feature Description Frequency Range 2.412GHz ~ 2.472GHz (2.4GHz ISM Band) Number of Channels 11 for North America, and 13 for Europe and Japan Modulation 802.11b: DQPSK, DBPSK, CCK 802.11g/n: OFDM /64-QAM,16-QAM, QPSK, BPSK Data Rate 802.11b: 1, 2, 5.5, 11Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps Data Rate (20 MHz, normal GI, 800 ns) 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Data Rate (20 MHz, short GI, 400 ns) 802.11n: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.
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ATWINC3400-MR210CA 9. Bluetooth Low Energy 4.0 The Bluetooth subsystem implements all the mission critical real-time functions. It encodes/decodes HCI packets, constructs baseband data packages, manages, and monitors the connection status, slot usage, data flow, routing, segmentation, and buffer control. The Bluetooth subsystem supports Bluetooth Low Energy modes of operation.
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ATWINC3400-MR210CA 10. External Interfaces 10.1 Interfacing with the Host Microcontroller This section describes about interfacing the ATWINC3400-MR210CA module with the host microcontroller. The interface comprises of a slave SPI and additional control signals, as shown in the following figure. For more information on SPI interface specification and timing, refer SPI Interface. Additional control signals are connected to the GPIO/IRQ interface of the microcontroller. Figure 10-1.
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ATWINC3400-MR210CA 10.2 SPI Interface 10.2.1 Overview The ATWINC3400-MR210CA has a Serial Peripheral Interface (SPI) that operates as an SPI slave. The SPI interface can be used for control and for serial I/O of 802.11 data. The SPI pins are mapped as shown in the following table. The SPI is a full-duplex slave-synchronous serial interface that is available immediately following reset when pin 10 (SPI_CFG) is tied to VDDIO. Table 10-2.
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ATWINC3400-MR210CA Figure 10-2. SPI Slave Clock Polarity and Clock Phase Timing CPOL = 0 SCK CPOL = 1 SSN CPHA = 0 RXD/TXD (MOSI/MISO) CPHA = 1 z 1 2 z 1 3 2 4 3 5 4 6 5 7 6 8 7 z 8 z The SPI timing is provided in the following figure and table. Figure 10-3. SPI Timing Diagram (SPI Mode CPOL=0, CPHA=0) f SCK t LH t WH SCK t WL t HL TXD t ODLY RXD t ISU t IHD SSN t SUSSN t HDSSN Table 10-4.
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ATWINC3400-MR210CA Parameter Symbol Min. Max. Units RXD Input Setup Time tISU 1 — RXD Input Hold Time tIHD 5 — SSN Input Setup Time tSUSSN 3 — SSN Input Hold Time tHDSSN 5.5 — Note: 1. Timing is applicable to all SPI modes 2. Maximum clock frequency specified is limited by the SPI Slave interface internal design, actual maximum clock frequency can be lower and depends on the specific PCB layout 3. Timing based on 15pF output loading 10.
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ATWINC3400-MR210CA 11. Application Reference Design The ATWINC3400-MR210CA module application schematics for different supported host interfaces are shown in this section. Host Interface - SPI Figure 11-1.
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ATWINC3400-MR210CA Item Quantity Referen ce Value Description Manufacturer Part Number Footprint Combo Module 2 1 U2 ASH7KW-32. 768kHZ-L-T Oscillator, Abracon® 32.768 kHz, Corporation +0/-175 ppm, 1.2V - 5.5V, -40°C - +85°C ASH7KW-3 OSCCC32 2.768kHZ-L- 0X150X10 T 0-4N 3 1 R1 1M RESISTOR, Thick Film, 1 MOhm, 0201 Panasonic ERJ-1GEJ1 RS0201 05C 4 13 R2-R14 0 RESISTOR, Thick Film, 0 Ohm, 0201 Panasonic ERJ-1GN0R RS0201 00C © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA 12. Module Outline Drawings The ATWINC3400-MR210CA module package details are outlined in the following figure. Figure 12-1. ATWINC3400-MR210CA Footprint and Module Package Drawings - Top , Bottom and Side View ATWINC3400-MR210CA ATWINC3400-MR210CA Untoleranced dimensions Note: 1. Dimensions are in mm. 2. It is recommended to have a 5x5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane on the inner/other layers of the host board.
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ATWINC3400-MR210CA 13. Design Consideration This section provides the guidelines on module placement and routing to achieve the best performance. 13.1 Module Placement and Routing Guidelines It is critical to follow the recommendations listed below to achieve the best RF performance: • The module must be placed on the host board and the chip antenna area must not overlap with the host board.
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ATWINC3400-MR210CA • • • • • Place GND polygon pour below the module on the top layer of the host board. Avoid breaks in this GND plane, ensure continuous GND plane for better RF performance. GND polygon pour in the top layer of the host board should have a minimum area of 20 x 40 mm. Place sufficient GND vias on host board edge and below the module for better RF performance.
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ATWINC3400-MR210CA Paramater Value Antenna P/N 2450AT18A100 Antenna vendor Johanson Technology © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA 14. Reflow Profile Information This section provides the guidelines for the reflow process to get the module soldered to the customer's design. 14.1 Storage Condition 14.1.1 Moisture Barrier Bag Before Opening A moisture barrier bag must be stored at a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product is 12 months from the date the bag is sealed. 14.1.
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ATWINC3400-MR210CA Temperature Profiling Temperature profiling must be performed for all new board designs by attaching thermocouples at the solder joints, on the top surface of the larger components, and at multiple locations of the boards. This is to ensure that all components are heated to a temperature above the minimum reflow temperatures and the smaller components do not exceed the maximum temperature limit.
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ATWINC3400-MR210CA Figure 14-1. Solder Reflow Profile Cleaning The exposed ground paddle helps to self-align the module, avoiding pad misalignment. The use of no clean solder pastes is recommended. As a result of reflow process, ensure to completely dry the no-clean paste fluxes. This may require longer reflow profiles and/or peak temperatures toward the high end of the process window as recommended by the solder paste vendor.
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ATWINC3400-MR210CA 15. Module Assembly Considerations The ATWINC3400-MR210CA module is assembled with an EMI shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions such as IPA and similar solvents can be used to clean this module. Cleaning solutions containing acid must never be used on the module. The ATWINC3400-MR210CA module is manufactured without any conformal coating applied.
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ATWINC3400-MR210CA 16. Regulatory Approval Regulatory Approvals received for ATWINC3400-MR210CA: • • • 16.1 United States/FCC ID: 2ADHKWINC3400 Canada/ISED: – IC: 20266-ATWINC3400 – HVIN: ATWINC3400-MR210CA Europe - CE (Approval pending) United States The ATWINC3400-MR210CA module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval.
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ATWINC3400-MR210CA This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
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ATWINC3400-MR210CA display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: For the ATWINC3400-MR210CA: Contains IC: 20266-ATWINC3400 User Manual Notice for License-Exempt Radio Apparatus (from Section 8.
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ATWINC3400-MR210CA 16.3 Europe Note: Pending for an approval. The ATWINC3400-MR210CA module is a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The ATWINC3400-MR210CA module has been tested to RED 2014/53/EU Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.
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ATWINC3400-MR210CA The European Compliance Testing listed in the preceeding table was performed using the integral chip antenna. 16.3.2.1 Simplified EU Declaration of Conformity Hereby, Microchip Technology Inc. declares that the radio equipment type ATWINC3400-MR210CA is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity for this product is available at http://www.microchip.com/ design-centers/wireless-connectivity/. 16.3.
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ATWINC3400-MR210CA 17. Reference Documentation The following are the set of collaterals to ease integration and device ramp. • • • • • Wi-Fi Network Controller Software Design Guide Application Note Integrated Serial Flash Memory Download Procedure Application Note Wi-Fi Network Controller Software Programming Guide Application Note ATWINC3400 XPro User Guide BLE Example Profiles Applications User Guide Note: For a complete listing of development-support tools and documentation, visit http://www.
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ATWINC3400-MR210CA 18. Document Revision History Rev A - 10/2017 Section Changes Document Initial Release © 2017 Microchip Technology Inc.
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ATWINC3400-MR210CA The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers.
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ATWINC3400-MR210CA Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: • • • • • Microchip products meet the specification contained in their particular Microchip Data Sheet.
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ATWINC3400-MR210CA ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.
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Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.