Datasheet

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface
Datasheet
SMSC USB3300 15 Revision 1.1 (01-24-13)
DATASHEET
Chapter 4 Operational Description
Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Table 4.1 Maximum Guaranteed Ratings
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Maximum VBUS, ID,
EXTVBUS, DP, and DM
voltage to GND
V
MAX_5V
-0.5 +5.5 V
Maximum VDD1.8 and
VDDA1.8 voltage to
Ground
V
MAX_1.8V
-0.5 2.5 V
Maximum 3.3V supply
voltage to Ground
V
MAX_3.3V
-0.5 4.0 V
Maximum I/O voltage to
Ground
V
MAX_IN
-0.5 4.0 V
Operating Temperature T
MAX_OP
-40 85
°C
Storage Temperature T
MAX_STG
-55 150
°C
ESD PERFORMANCE
All Pins V
HBM
Human Body Model
±8
kV
LATCH-UP PERFORMANCE
All Pins I
LTCH_UP
EIA/JESD 78, Class II 150 mA
Table 4.2 Recommended Operating Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VDD3.3 to GND V
DD3.3
3.0 3.3 3.6 V
Input Voltage on Digital
Pins
V
I
0.0 V
DD3.3
V
Voltage on Analog I/O
Pins (DP, DM, ID)
V
I(I/O)
0.0 V
DD3.3
V
VBUS to GND V
VBUS
0.0 5.25
Ambient Temperature T
A
-40 85 C