Datasheet

2-Port USB 2.0 Hi-Speed Hub Controller
Datasheet
SMSC USB2412 19 Revision 1.3 (12-27-11)
DATASHEET
4.2.1 Pin Capacitance
4.2.2 Package Thermal Specifications
Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
Table 4.2 Pin Capacitance
LIMITS
PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION
Clock Input
Capacitance
C
XTAL
6 pF All pins except USB pins and the pins
under the test tied to AC ground.
Input Capacitance C
IN
6 pF Capacitance T
A
= 25°C
fc = 1 MHz
VDD33 = 3.3 V
Output Capacitance C
OUT
6 pF The maximum capacitance values
include the full length of the pin pad. See
the Y dimension in Figure 6.2.
Table 4.3 28-Pin QFN Package Thermal Parameters
PARAMETER
VELOCITY
(meters/sec) SYMBOL VALUE UNIT
Thermal Resistance 0
Θ
JA
40.3
°C/W
135.2
Junction-to-Top-of-Package 0
Ψ
JT
0.5
°C/W
10.6